Product Information by Application - TB3114E
TB3114E is an epoxy resin-based solvent-free ultraviolet-curing resin. Since the resin cures through optical cationic polymerization, it is not inhibited from curing by oxygen, and therefore does not suffer from surface tackiness after cure.
|Product Number||Series||Product Type||Application(s)||Other Features|
|TB3114E|| • 3000|
|Adhesive|| • Electronics Bonding/Sealing|
• Light Cure Adhesives
UV epoxy low shrinkage
The resin is cured by irradiation of ultraviolet light (wavelength: 200 to 400 nm).
Its shrinkage factor during curing is low.
It excels in surface curability.
It exhibits good adhesion to various materials, such as glass, metals and plastics.
It does not need to be heated after irradiated by ultraviolet light.
Suitable for bonding and securing optical components and precisely bonding and securing electrical and electronic parts.
- Colour: Grey
- Reaction Type:
- Viscosity: 15,000 mPa.s
- Specific Gravity: 1.50
- Skin Over Time:
- Shore Harness: 75D
- Tensile Strength:
- Shear Strength: 10.3 MPa (glass)
- Pressure Resistance:
- Effective Temperature Range: -40°C ~ +150°C
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel:
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::