Product Information by Application - TB2086M
TB2086M consists of two-component epoxy resin and hardener which is designed for fast fixturing and bonding of a wide range of materials. Handleable bonds are achieved in as little as 5 minutes whilst full properties can be attained in 30 minutes at room temperature. Compared with standard types TB2086M has improved low temperature curing characteristics, higher impact resistance and excellent workability due to its low viscosity.
|Product Number||Series||Product Type||Application(s)||Other Features|
|TB2086M|| • 2000||Adhesive|| • Electronics Bonding/Sealing|
• Structural Bonding
Mix ratio 1:1.
Packaged in 50ml twin cartridge.
Rapid setting within minutes at room temperature.
Low viscosity mixed resin with excellent flowability.
Transparent when mixed for cosmetically sensitive parts.
The cured resin excels in electric properties, mechanical strength and chemical resistance.
Bonds a wide range of materials including metals, engineered plastics, ceramics, stone,
wood, FRP and rubbers.
Low temperature 5ºC setting capability.
- Colour: Clear
- Reaction Type:
- Viscosity: 13 / 10 Pa.s
- Specific Gravity:
- Skin Over Time: Pot life 5 mins
- Shore Harness: 85D
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time: 5-30 mins
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel: 20.3 MPa (steel)
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::