Produktinformationen nach Anwendungsgebiet
Electronics Bonding/Sealing
| Product Number | Product Type | Features & Uses | More Information |
|---|---|---|---|
| TB1211 | RTV silicone de-oxime type liquid gasket | Flowable paste, general purpose sealing | |
| TB1212 | RTV silicone de-oxime type liquid gasket | Non-flow paste general purpose sealing | |
| TB1220H | RTV silicone de-alcohol type sealant | Flowable paste, electrical parts sealant, low siloxane content | |
| TB1221H | RTV silicone de-alcohol type sealant | Non-flowable paste, electrical parts sealant, low siloxane content | |
| TB1225B | RTV silicone de-alcohol type sealant | Flowable paste, electrical parts sealant, heat transfer type 1.59Wm.k | |
| TB1230G | RTV silicone addition type potting agent | 2-part silicone potting agent for electrical use | |
| TB1521 | Synthetic rubber adhesive | Synthetic rubber cement, 30 minute tack retain time | |
| TB1521B | Synthetic rubber adhesive | Synthetic rubber cement, 90 minute tack retain time | |
| TB1521C | Synthetic rubber adhesive | Synthetic rubber cement, 40 minutes tack retain time | |
| TB1530 | MS polymer | MS polymer elastic adhesive white | |
| TB1530B | MS polymer | MS polymer elastic adhesive non-flowing black |
|
| TB1530C | MS polymer | MS polymer elastic adhesive clear | |
| TB1533 | MS polymer | MS polymer elastic adhesive white DBT free | |
| TB1533C | MS polymer | Clear version of TB1533 MS polymer elastic adhesive, DBT free | |
| TB1537 | MS polymer | MS polymer elastic adhesive UL94 V0 certified | |
| TB1537B | MS polymer | Black version TB1537 MS polymer elastic adhesive, flame retardant grade | |
| TB1537D | MS polymer | Grey version TB1537 MS polymer elastic adhesive, flame retardant grade | |
| TB1630 | Sheet adhesive UV curable | Sheet adhesive UV curable | |
| TB1655 | Sheet adhesive heat curable | Sheet adhesive heat curable | |
| TB2082C | 2k Epoxy Resin | High shear strength rubber toughened | |
| TB2086M | 2k Epoxy Resin | Rapid setting type | |
| TB2202C | 1k Epoxy Resin, heat curing | General bonding and sealing, cure from 70°C | |
| TB2206C | 1k Epoxy Resin, heat curing | General bonding and sealing, cure from 70°C | |
| TB2210 | 1k Epoxy Resin, heat curing | Low viscosity, cure from 80°C | |
| TB2212B | 1k Epoxy Resin, heat curing | Medium viscosity, cure from 80°C | |
| TB2217H | 1k Epoxy Resin, heat curing | SMT chipbonding adhesive | |
| TB2217L | 1k Epoxy Resin, heat curing | SMT chipbonding adhesive |
|
| TB2224D | 1k Epoxy Resin, heat curing | General purpose, cure from 100°C | |
| TB2233K | 1k Epoxy Resin, heat curing | General purpose, cure from 120°C |
|
| TB2233Q | 1k Epoxy Resin, heat curing | General purpose, fast cure 120°C | |
| TB2270J | 1k Epoxy resin, heat curing | Heat dissipation type 4.2 W/m•k | |
| TB2272F | 1k Epoxy Resin, heat curing | Flame retardant grade certified UL94 V-0 | |
| TB2274E | 1k Epoxy Resin, heat curing | SMT underfill adhesive, quick curing | |
| TB3001C | UV + visible light curing adhesive | Soft and flexible type | |
| TB3003H | UV curing adhesive | General bonding and sealing, transparent type | |
| TB3035B | UV curing adhesive | Sealant for Dye Sensitized Cells (DSC) | |
| TB3042M | UV curing adhesive | Low viscosity for glass chip filling and bonding | |
| TB3045C | UV + visible light curing adhesive | Flame Retardant Grade | |
| TB3057B | UV + heat curing adhesive | Secondary heat cure |
|
| TB3065E | UV + anaerobic curing adhesive | Secondary anaerobic cure | |
| TB3081N | UV curing gasket | UV Cured in Place gasket | |
| TB3114E | UV curing adhesive | UV epoxy low shrinkage type | |
| TB3161 | UV curing silicone | UV silicone, low viscosity | |
| TB3164 | UV curing silicone | UV silicone high viscosity | |
| TB3164D | UV curing silicone | UV silicone medium viscosity | |
| TB3301 | 1k silver epoxy heat curing | 120°C curing, 9H, volume resistivity 5 x 10-6 Ω.m, non solvent type | |
| TB3301F | 1k silver epoxy heat curing | 120°C curing, 4H, volume resistivity 1~2 x 10-6 Ω.m, solvent type | |
| TB3301W | 1k silver epoxy heat curing | 120°C curing, 4H, volume resistivity 1.6 x 10-6 Ω.m, non solvent type | |
| TB3302B | 1k silver urethane heat curing | 120°C curing, 5B, volume resistivity 5~6 x 10-6 Ω.m | |
| TB3303G NEO | 1k silver silicone heat curing | 180°C curing, <6B, volume resistivity 2.5 x 10-6 Ω.m, solvent type | |
| TB3303M | 1k silver silicone heat curing | 180°C curing, <6B, volume resistivity 1.9 x 10-6 Ω.m, solvent type | |
| TB3315E | 1k carbon elastomer heat curing | 80°C curing, volume resistivity 4.3 x 10-2 Ω.m | |
| TB3373F | Anisotropic conductive paste | For PCB heat seal connector | |
| TB3380B | 2k silver epoxy | 60°C or RT curing, 5H, volume resistivity 1.5 x 10-5 Ω.m, solvent free type | |
| TB3732 | Silicate cement | Heat resistant to over 1,400°C |
55 results found.