Product Information by Series
« Back
2000/2100/2200 series
Epoxy resins
| Product Number | Product Type | Features & Uses | More Information |
|---|---|---|---|
| TB2082C | 2k Epoxy Resin | High shear strength rubber toughened | |
| TB2086M | 2k Epoxy Resin | Rapid setting type | |
| TB2202C | 1k Epoxy Resin, heat curing | General bonding and sealing, cure from 70°C | |
| TB2206C | 1k Epoxy Resin, heat curing | General bonding and sealing, cure from 70°C | |
| TB2210 | 1k Epoxy Resin, heat curing | Low viscosity, cure from 80°C | |
| TB2212B | 1k Epoxy Resin, heat curing | Medium viscosity, cure from 80°C | |
| TB2217H | 1k Epoxy Resin, heat curing | SMT chipbonding adhesive | |
| TB2217L | 1k Epoxy Resin, heat curing | SMT chipbonding adhesive | |
| TB2224D | 1k Epoxy Resin, heat curing | General purpose, cure from 100°C | |
| TB2233K | 1k Epoxy Resin, heat curing | General purpose, cure from 120°C | |
| TB2233Q | 1k Epoxy Resin, heat curing | General purpose, fast cure 120°C | |
| TB2270J | 1k Epoxy resin, heat curing | Heat dissipation type 4.2 W/m•k | |
| TB2272F | 1k Epoxy Resin, heat curing | Flame retardant grade certified UL94 V-0 | |
| TB2273D | 1k Epoxy Resin, heat curing | Magnet bonding | |
| TB2273E | 1k Epoxy Resin, heat curing | Higher thixotropic index version of 2273D | |
| TB2273F | 1k Epoxy Resin, heat curing | TB2273D version with 100µm spacers | |
| TB2274E | 1k Epoxy Resin, heat curing | SMT underfill adhesive, quick curing | |
| TB2285D | 1k Epoxy Resin, heat curing | Magnet bonding, high temperature resistance |
18 results found.
« Back