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| Product Number | Product Type | Features & Uses | More Information |
|---|
| TB3301 | 1k silver epoxy heat curing | 120°C curing, 9H, volume resistivity 5 x 10-6 Ω.m, non solvent type | View » |
| TB3301F | 1k silver epoxy heat curing | 120°C curing, 4H, volume resistivity 1~2 x 10-6 Ω.m, solvent type | View » |
| TB3301W | 1k silver epoxy heat curing | 120°C curing, 4H, volume resistivity 1.6 x 10-6 Ω.m, non solvent type | View » |
| TB3302B | 1k silver urethane heat curing | 120°C curing, 5B, volume resistivity 5~6 x 10-6 Ω.m | View » |
| TB3303G NEO | 1k silver silicone heat curing | 180°C curing, <6B, volume resistivity 2.5 x 10-6 Ω.m, solvent type | View » |
| TB3303M | 1k silver silicone heat curing | 180°C curing, <6B, volume resistivity 1.9 x 10-6 Ω.m, solvent type | View » |
| TB3315E | 1k carbon elastomer heat curing | 80°C curing, volume resistivity 4.3 x 10-2 Ω.m | View » |
| TB3373F | Anisotropic conductive paste | For PCB heat seal connector | View » |
| TB3380B | 2k silver epoxy | 60°C or RT curing, 5H, volume resistivity 1.5 x 10-5 Ω.m, solvent free type | View » |
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