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Home › Products › TB2086M

Product Information - TB2086M

TB2086M



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TB2086M consists of two-component epoxy resin and hardener which is designed for fast fixturing and bonding of a wide range of materials. Handleable bonds are achieved in as little as 5 minutes whilst full properties can be attained in 30 minutes at room temperature. Compared with standard types TB2086M has improved low temperature curing characteristics, higher impact
resistance and excellent workability due to its low viscosity.

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB2086M 2000/2100/2200 seriesAdhesives
  • Electronics Bonding/Sealing
  • Potting/Encapsulation
  • Structural Bonding

    Features



    Mix ratio 1:1.
    Packaged in 50ml twin cartridge.
    Rapid setting within minutes at room temperature.
    Low viscosity mixed resin with excellent flowability.
    Transparent when mixed for cosmetically sensitive parts.
    The cured resin excels in electric properties, mechanical strength and chemical resistance.
    Bonds a wide range of materials including metals, engineered plastics, ceramics, stone,
    wood, FRP and rubbers.
    Low temperature 5ÂșC setting capability.


    Technical


    • Colour: Clear
    • Disassembly:
    • Reaction Type:
    • Viscosity: 13 / 10 Pa.s
    • Specific Gravity:
    • Skin Over Time: Pot life 5 mins
    • Shore Harness: 85D
    • Elongation:
    • Tensile Strength:
    • Shear Strength:
    • Pressure Resistance:
    • Effective Temperature Range:
    • Cured state:
    • Volume Resistivity:
    • Dielectric breakdown strength:
    • Dielectric constant 1MHz:
    • Dissipation Factor 1MHz:
    • Thermal conductivity:
    • Fixture time: 5-30 mins
    • Break loose torque:
    • Prevailing torque:
    • Retaining Strength (Steel):
    • Max thread size or clearance:
    • Max clearance:
    • Tack free time:
    • Tack retain time:
    • Lap Shear Strength Steel: 20.3 MPa (steel)
    • Peel strength Steel:
    • Setting time Metal:
    • Setting time Rubber:
    • Strength:
    • Binder:
    • Solvent:
    • Substrates:
    • Curing Conditions:
    • Glass Transition Point (°C):
    • Pencil Hardness:
    • Linear expansion coefficient ppm/°C::

    TB2086M

    • Product Information
    • Product Information by Series
    • Product Information by Function
      • Automotive Fluid Resistance
      • White Label MSDS
      • Hard to Bond Surfaces
      • Highly Peelable and Shock Resistant
      • High Heat Resistance
      • Heat Dissipation
      • Flame Retardant
      • Low Outgassing
    • Product Information by Application
      • Gasketing
      • Powertrain Sealing
      • Thread Sealing
      • Threadlocking/Retaining
      • Instant Bonding
      • Structural Bonding
      • Flexible Bonding
      • Magnet Bonding
      • Electronics Bonding/Sealing
      • Potting/Encapsulation
      • Light Cure Adhesive
      • Electroconductive Adhesive
      • Surface Preparation/Protection