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Home › Products › TB2202C

Product Information - TB2202C

TB2202C



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TB2202C has been developed for general bonding, sealing and moulding with curing being initiated as low as 70°C with the capability of curing at 150°C in 1 minute. Easy application as the product is one-component and free from solvents (no weighing, stirring or mixing required). The fast curing of the resin allows considerable energy savings and facilitates the automation of assembly works. Resin contains more than 99.5 % of non-volatile content, there is only a minimal shrinkage and outgassing while curing. The cured resin excels in electric properties as well as mechanical strength and very good chemical resistance.

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB2202C 2000/2100/2200 seriesAdhesives
  • Electronics Bonding/Sealing
  • Potting/Encapsulation
  • Structural Bonding

    Features



    Low temperature, quick hardening (over 70°C).
    Low viscosity, easy to dispense; good penetration and levelling properties
    Excellent adhesion and heat resistance
    White colour, excellent in concealing of blemishes
    For bonding, sealing and filling relays, buzzers, switches and electronic equipment components.
    For bonding and filling metals and plastics.




    Technical


    • Colour: White
    • Disassembly:
    • Reaction Type:
    • Viscosity: 27 Pa.s
    • Specific Gravity:
    • Skin Over Time:
    • Shore Harness: 90D
    • Elongation:
    • Tensile Strength:
    • Shear Strength:
    • Pressure Resistance:
    • Effective Temperature Range:
    • Cured state:
    • Volume Resistivity:
    • Dielectric breakdown strength:
    • Dielectric constant 1MHz:
    • Dissipation Factor 1MHz:
    • Thermal conductivity:
    • Fixture time:
    • Break loose torque:
    • Prevailing torque:
    • Retaining Strength (Steel):
    • Max thread size or clearance:
    • Max clearance:
    • Tack free time:
    • Tack retain time:
    • Lap Shear Strength Steel: 15.5 Mpa
    • Peel strength Steel: 0.2 kN/m
    • Setting time Metal:
    • Setting time Rubber:
    • Strength:
    • Binder:
    • Solvent:
    • Substrates:
    • Curing Conditions: 70°C x 50 mins
    • Glass Transition Point (°C): 105°C
    • Pencil Hardness:
    • Linear expansion coefficient ppm/°C::

    TB2202C

    • Product Information
    • Product Information by Series
    • Product Information by Function
      • Automotive Fluid Resistance
      • White Label MSDS
      • Hard to Bond Surfaces
      • Highly Peelable and Shock Resistant
      • High Heat Resistance
      • Heat Dissipation
      • Flame Retardant
      • Low Outgassing
    • Product Information by Application
      • Gasketing
      • Powertrain Sealing
      • Thread Sealing
      • Threadlocking/Retaining
      • Instant Bonding
      • Structural Bonding
      • Flexible Bonding
      • Magnet Bonding
      • Electronics Bonding/Sealing
      • Potting/Encapsulation
      • Light Cure Adhesive
      • Electroconductive Adhesive
      • Surface Preparation/Protection