Product Information - TB2212B
TB2212B
TB2212B has been developed for general bonding, sealing and moulding with curing being initiated as low as 80°C with the capability of curing at 150°C in 1 minute. Easy application as the product is one-component and free from solvents (no weighing, stirring or mixing required). The fast curing of the resin allows considerable energy savings and facilitates the automation of assembly works. Resin contains more than 99.5 % of non-volatile content, there is only a minimal shrinkage and outgassing while curing. The cured resin excels in electric properties as well as mechanical strength and very good chemical resistance.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB2212B | 2000/2100/2200 series | Adhesives |
|
Features
1-part epoxy, general purpose, medium viscosity, cure from 80°C
Low temperature; quick hardening (over 80°C)
Medium viscosity
Excellent bonding
Excellent heat resistance to 150°C
Excellent electrical insulation
For general bonding
For potting electrical parts
For sealing electrical parts
Technical
- Colour: Black
- Disassembly:
- Reaction Type:
- Viscosity: 25 Pa.s
- Specific Gravity: 1.39
- Skin Over Time:
- Shore Harness: 93D
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range: -50°C ~ +150°C
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel: 8.9 Mpa
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::