Product Information - TB3301W
TB3301W
TB3301W is a non solvent type electro-conductive one part epoxy resin that cures when
heated.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB3301W | 3300 series | Adhesives |
|
Features
Can be used for pin bonding and surface bonding
One-part epoxy silver filled resin
The resin cures under heating
Thixotropic index 3.3
Low out-gassing type
Fixing Quartz parts
Pin bonding and Surface bonding
Technical
- Colour: Aluminium/Silver
- Disassembly:
- Reaction Type:
- Viscosity: 37 Pa.s
- Specific Gravity:
- Skin Over Time:
- Shore Harness:
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity: 1.6 x 10E-6 Ω.m
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel: 12 MPa
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::