Product Information - TB3303G NEO
TB3303G NEO
TB3303G (NEO) is a silicone conductive adhesive developed for SMD crystal.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB3303G NEO | 3300 series | Adhesives |
|
Features
Because the cured material is soft, has excellent stress reduction
Can be cured at 180 ℃ × 1h.
Good adhesion to gold-plated and silver-plated substrates
For connecting electrodes for small quartz crystals, crystal oscillators and surface acoustic
wave filter in piezoelectric elements.
To fix point bonding and chip parts
Technical
- Colour: Aluminium/Silver
- Disassembly:
- Reaction Type:
- Viscosity: 40 Pa.s (thixo)
- Specific Gravity:
- Skin Over Time:
- Shore Harness:
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity: 2.5 x 10E-6 Ω.m
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel:
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions: 180°C x 60 mins
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::