Product Information - TB3373F
TB3373F
TB3373F is an anisotropically-conductive adhesive which is applied to a film substrate by screen printing and dried to form an interconnection film
directly on the substrate. Since the adhesive can be used for connection in a pressure-bonding
temperature range of 120°C to 160°C, the process with the adhesive can be controlled
easily compared to those with heat-curing anisotropically-conductive adhesives.
This product is a low halogen content material. The total chlorine content
and total bromine content are less than 900 ppm each, and the sum of total chlorine
content and total bromine content is less than 1500 ppm.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB3373F | 3300 series | Adhesives |
|
Features
Bonding and connecting of touch panels and FPCs
Bonding and connecting of membrane switches
Bonding and connecting of small LC panels and FPCs
Bonding and connecting of EL backlight terminals, and general bonding of film substrates
Technical
- Colour: Aluminium/Silver
- Disassembly:
- Reaction Type:
- Viscosity: 60 Pa.s
- Specific Gravity: 1.08
- Skin Over Time:
- Shore Harness:
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel:
- Peel strength Steel: 0.88 kN/m PET/glass
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::