Product Information - TB1533C
TB1533C
TB1533C is a multi-purpose, high strength elastic adhesive based on an MS polymer which reacts rapidly upon exposure to moisture in the air and cures to form a toughened elastomer with time. Containing no solvents, plastisizers, or isocyanates, the adhesive has excellent non-staining characteristics against substrates and is over-paintable. It provides excellent weather resistance, high adhesion strength to most substrates without the need for pre-treatment, and is user friendly due to its low odour. In addition to bonding TB1533C can be used for sealing and potting electrical components as no low-molecular siloxanes are produced during curing.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB1533C | 1500 series | Adhesives |
|
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Features
Materials which can be bonded:
Natural and synthetic rubbers (CR,SBR, EPDM, NBR, etc.)
(Note: The product is not suitable for bonding Polyethylene, Polyacetal and Fluororesin.)
Metals (Steel, Aluminium, Duraluminium, Brass, etc.)
Plastics (Polyvinylchloride, Polymethacrylic, Phenolic resin, Polystyrene, Ebonite, etc.)
Non-metals (Wood, fabrics, leather, ceramics, paper, concrete, mortar, etc.)
Technical
- Colour: Clear
- Disassembly:
- Reaction Type:
- Viscosity: 100 Pa.s
- Specific Gravity: 1.30
- Skin Over Time: 7 mins
- Shore Harness: 50A
- Elongation: 145%
- Tensile Strength: 3.8 MPa
- Shear Strength: 4.7 MPa (Al)
- Pressure Resistance:
- Effective Temperature Range: -40°C ~ +120°C
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength: 25 MV/m
- Dielectric constant 1MHz: 4.8
- Dissipation Factor 1MHz:
- Thermal conductivity: 0.29 Wm.k
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel:
- Peel strength Steel: 2.5 kN/m (steel)
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::