Product Information by Application

Electronics Bonding/Sealing

Product Number	Product Type	Features & Uses	More Information
TB1211	RTV silicone de-oxime type liquid gasket	Flowable paste, general purpose sealing	View »
TB1212	RTV silicone de-oxime type liquid gasket	Non-flow paste general purpose sealing	View »
TB1220H	RTV silicone de-alcohol type sealant	Flowable paste, electrical parts sealant, low siloxane content	View »
TB1221H	RTV silicone de-alcohol type sealant	Non-flowable paste, electrical parts sealant, low siloxane content	View »
TB1225B	RTV silicone de-alcohol type sealant	Flowable paste, electrical parts sealant, heat transfer type 1.59Wm.k	View »
TB1230G	RTV silicone addition type potting agent	2-part silicone potting agent for electrical use	View »
TB1521	Synthetic rubber adhesive	Synthetic rubber cement, 30 minute tack retain time	View »
TB1521B	Synthetic rubber adhesive	Synthetic rubber cement, 90 minute tack retain time	View »
TB1521C	Synthetic rubber adhesive	Synthetic rubber cement, 40 minutes tack retain time	View »
TB1530	MS polymer	MS polymer elastic adhesive white	View »
TB1530B	MS polymer	MS polymer elastic adhesive non-flowing black	View »
TB1530C	MS polymer	MS polymer elastic adhesive clear	View »
TB1533	MS polymer	MS polymer elastic adhesive white DBT free	View »
TB1533C	MS polymer	Clear version of TB1533 MS polymer elastic adhesive, DBT free	View »
TB1537	MS polymer	MS polymer elastic adhesive UL94 V0 certified	View »
TB1537B	MS polymer	Black version TB1537 MS polymer elastic adhesive, flame retardant grade	View »
TB1537D	MS polymer	Grey version TB1537 MS polymer elastic adhesive, flame retardant grade	View »
TB1630	Sheet adhesive UV curable	Sheet adhesive UV curable	View »
TB1655	Sheet adhesive heat curable	Sheet adhesive heat curable	View »
TB2082C	2k Epoxy Resin	High shear strength rubber toughened	View »
TB2086M	2k Epoxy Resin	Rapid setting type	View »
TB2202C	1k Epoxy Resin, heat curing	General bonding and sealing, cure from 70°C	View »
TB2206C	1k Epoxy Resin, heat curing	General bonding and sealing, cure from 70°C	View »
TB2210	1k Epoxy Resin, heat curing	Low viscosity, cure from 80°C	View »
TB2212B	1k Epoxy Resin, heat curing	Medium viscosity, cure from 80°C	View »
TB2217H	1k Epoxy Resin, heat curing	SMT chipbonding adhesive	View »
TB2217L	1k Epoxy Resin, heat curing	SMT chipbonding adhesive	View »
TB2224D	1k Epoxy Resin, heat curing	General purpose, cure from 100°C	View »
TB2233K	1k Epoxy Resin, heat curing	General purpose, cure from 120°C	View »
TB2233Q	1k Epoxy Resin, heat curing	General purpose, fast cure 120°C	View »
TB2270J	1k Epoxy resin, heat curing	Heat dissipation type 4.2 W/m•k	View »
TB2272F	1k Epoxy Resin, heat curing	Flame retardant grade certified UL94 V-0	View »
TB2274E	1k Epoxy Resin, heat curing	SMT underfill adhesive, quick curing	View »
TB3001C	UV + visible light curing adhesive	Soft and flexible type	View »
TB3003H	UV curing adhesive	General bonding and sealing, transparent type	View »
TB3035B	UV curing adhesive	Sealant for Dye Sensitized Cells (DSC)	View »
TB3042M	UV curing adhesive	Low viscosity for glass chip filling and bonding	View »
TB3045C	UV + visible light curing adhesive	Flame Retardant Grade	View »
TB3057B	UV + heat curing adhesive	Secondary heat cure	View »
TB3065E	UV + anaerobic curing adhesive	Secondary anaerobic cure	View »
TB3081N	UV curing gasket	UV Cured in Place gasket	View »
TB3114E	UV curing adhesive	UV epoxy low shrinkage type	View »
TB3161	UV curing silicone	UV silicone, low viscosity	View »
TB3164	UV curing silicone	UV silicone high viscosity	View »
TB3164D	UV curing silicone	UV silicone medium viscosity	View »
TB3301	1k silver epoxy heat curing	120°C curing, 9H, volume resistivity 5 x 10-6 Ω.m, non solvent type	View »
TB3301F	1k silver epoxy heat curing	120°C curing, 4H, volume resistivity 1~2 x 10-6 Ω.m, solvent type	View »
TB3301W	1k silver epoxy heat curing</