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Home › Products › TB1655

Product Information - TB1655

TB1655



Click to expand

TB1655 is a heat-reacting type film adhesive developed for use with flexible printed circuit boards (FPC). TB1655 is most suitable for mass-production of FPCs being easy to use and is also flame-retardant,

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB1655 1600 seriesAdhesives
  • Electronics Bonding/Sealing
  • Flexible Bonding
  • Flame Retardant
  • Highly Peelable / Shock Resistant

Features



Bonding of a metal foil and insulation film (FPC manufacturing)
Bonding of cover layer
Bonding of FPC and rigid board
Bonding of sheet heating element. Coil, etc.


Technical


  • Colour: Clear
  • Disassembly:
  • Reaction Type:
  • Viscosity:
  • Specific Gravity:
  • Skin Over Time:
  • Shore Harness:
  • Elongation:
  • Tensile Strength:
  • Shear Strength:
  • Pressure Resistance:
  • Effective Temperature Range:
  • Cured state:
  • Volume Resistivity:
  • Dielectric breakdown strength:
  • Dielectric constant 1MHz:
  • Dissipation Factor 1MHz:
  • Thermal conductivity:
  • Fixture time:
  • Break loose torque:
  • Prevailing torque:
  • Retaining Strength (Steel):
  • Max thread size or clearance:
  • Max clearance:
  • Tack free time:
  • Tack retain time:
  • Lap Shear Strength Steel:
  • Peel strength Steel: 4.0 kN/m (Al)
  • Setting time Metal:
  • Setting time Rubber:
  • Strength:
  • Binder:
  • Solvent:
  • Substrates:
  • Curing Conditions:
  • Glass Transition Point (°C):
  • Pencil Hardness:
  • Linear expansion coefficient ppm/°C::

TB1655

  • Product Information
  • Product Information by Series
  • Product Information by Function
    • Automotive Fluid Resistance
    • White Label MSDS
    • Hard to Bond Surfaces
    • Highly Peelable and Shock Resistant
    • High Heat Resistance
    • Heat Dissipation
    • Flame Retardant
    • Low Outgassing
  • Product Information by Application
    • Gasketing
    • Powertrain Sealing
    • Thread Sealing
    • Threadlocking/Retaining
    • Instant Bonding
    • Structural Bonding
    • Flexible Bonding
    • Magnet Bonding
    • Electronics Bonding/Sealing
    • Potting/Encapsulation
    • Light Cure Adhesive
    • Electroconductive Adhesive
    • Surface Preparation/Protection
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