Product Information - TB2217H
TB2217H
TB2217H is a single component epoxy resin developed for bonding electronic chips, curing at temperatures of 80C and above. Its properties are designed for ease of handling to enable use in automated assembly by either Pump Print, syringe or screen print application.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB2217H | 2000/2100/2200 series | Adhesives |
|
Features
Ideal viscosity and thixotropic properties for dispensing and screen printing. Maintains shape after application.
No cobwebbing, no dispenser feeding problems, excellent process ability.
Hardens in less than 60 seconds at 150ºC.
Heat curing initiated at just 80ºC.
Excellent heat resistance. Meets the requirements of IPC SM817, TM-650 Method 2.4.42.1: R-1206 on bare FR4 board supported 60 seconds above solder bath at 260ºC and dipped for 10 seconds.
Technical
- Colour: Pink
- Disassembly:
- Reaction Type:
- Viscosity: 196 Pa.s
- Specific Gravity: 1.24
- Skin Over Time:
- Shore Harness: 89D
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel: 25.2 MPa
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::