Product Information - TB2270J
TB2270J
TB2270J has been developed with a high thermal conductivity of 4.2 W/m.k Heat caused by electrical parts as well as electronic and electric parts that have been downsized and made more powerful affects the operation, performance, and other aspects of the mounted parts. In order to resolve this issue, TB2270J offers superior heat dissipation properties.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB2270J | 2000/2100/2200 series | Adhesives |
|
|
Features
1-part epoxy heat dissiptaion type 4.2 W/m•k
Cures at 100°C x 40 minutes
Heat dissipation for integrated circuit's heat sink
Heat dissipation coating of electrical motors, etc.
Heat dissipation and insulation of electric and electronic parts that emit heat
Technical
- Colour: White
- Disassembly:
- Reaction Type:
- Viscosity: 150 Pa.s
- Specific Gravity:
- Skin Over Time:
- Shore Harness: 96D
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel:
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::