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Home › Products › TB2272F

Product Information - TB2272F

TB2272F



Click to expand

TB2272F is a single component, heat curable, epoxy compound resin. This product is certified to UL94 (vertical burning test) V-0 flammability standard and
suitable for bonding and sealing parts around potential heat sources.

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB2272F 2000/2100/2200 seriesAdhesives
  • Electronics Bonding/Sealing
  • Flame Retardant

Features



1-part epoxy flame retardant grade certified UL94 V-0
Bonding and sealing of parts around potential heat sources


Technical


  • Colour: Black
  • Disassembly:
  • Reaction Type:
  • Viscosity: 75 Pa.s
  • Specific Gravity: 1.64
  • Skin Over Time:
  • Shore Harness: 92D
  • Elongation:
  • Tensile Strength:
  • Shear Strength:
  • Pressure Resistance:
  • Effective Temperature Range:
  • Cured state:
  • Volume Resistivity:
  • Dielectric breakdown strength:
  • Dielectric constant 1MHz:
  • Dissipation Factor 1MHz:
  • Thermal conductivity:
  • Fixture time:
  • Break loose torque:
  • Prevailing torque:
  • Retaining Strength (Steel):
  • Max thread size or clearance:
  • Max clearance:
  • Tack free time:
  • Tack retain time:
  • Lap Shear Strength Steel: 21.0 MPa
  • Peel strength Steel:
  • Setting time Metal:
  • Setting time Rubber:
  • Strength:
  • Binder:
  • Solvent:
  • Substrates:
  • Curing Conditions:
  • Glass Transition Point (°C):
  • Pencil Hardness:
  • Linear expansion coefficient ppm/°C::

TB2272F

  • Product Information
  • Product Information by Series
  • Product Information by Function
    • Automotive Fluid Resistance
    • White Label MSDS
    • Hard to Bond Surfaces
    • Highly Peelable and Shock Resistant
    • High Heat Resistance
    • Heat Dissipation
    • Flame Retardant
    • Low Outgassing
  • Product Information by Application
    • Gasketing
    • Powertrain Sealing
    • Thread Sealing
    • Threadlocking/Retaining
    • Instant Bonding
    • Structural Bonding
    • Flexible Bonding
    • Magnet Bonding
    • Electronics Bonding/Sealing
    • Potting/Encapsulation
    • Light Cure Adhesive
    • Electroconductive Adhesive
    • Surface Preparation/Protection
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