Product Information - TB2274E
TB2274E
TB2274E is a one-part epoxy compound resin developed as a high-reliability underfill agent for mounting CSP and BGA. The epoxy improves the
connection reliability against external thermal and physical stresses after mounting of CSP and BGA components.
Product Information
| Product Number | Series | Product Type | Application(s) | Other Features |
|---|---|---|---|---|
| TB2274E | 2000/2100/2200 series | Adhesives |
|
Features
1-part epoxy, SMT underfill adhesive, quick curing
Adequate viscosity: Excellent workability and capillary for complete spread without voids.
Sealing and reinforcement (underfill) of CSP and BGA
Technical
- Colour: White
- Disassembly:
- Reaction Type:
- Viscosity: 3,500 mPa.s
- Specific Gravity: 1.28
- Skin Over Time:
- Shore Harness:
- Elongation:
- Tensile Strength:
- Shear Strength:
- Pressure Resistance:
- Effective Temperature Range:
- Cured state:
- Volume Resistivity:
- Dielectric breakdown strength:
- Dielectric constant 1MHz:
- Dissipation Factor 1MHz:
- Thermal conductivity:
- Fixture time:
- Break loose torque:
- Prevailing torque:
- Retaining Strength (Steel):
- Max thread size or clearance:
- Max clearance:
- Tack free time:
- Tack retain time:
- Lap Shear Strength Steel: 16.0 MPa
- Peel strength Steel:
- Setting time Metal:
- Setting time Rubber:
- Strength:
- Binder:
- Solvent:
- Substrates:
- Curing Conditions:
- Glass Transition Point (°C):
- Pencil Hardness:
- Linear expansion coefficient ppm/°C::