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Home › Products › TB3301

Product Information - TB3301

TB3301



Click to expand

TB3301 is an electroconductive adhesive of single fluid, thermosetting type, characterised
by quick hardening at elevated temperature. In contrast to solder, strong adhesion is provided for
plastic, rubber and ceramic. Applicable to bonding of lead wire to electrodes.

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB3301 3300 seriesAdhesives
  • Electroconductive Adhesives
  • Electronics Bonding/Sealing

    Features



    Lead wire of electronic components and electronic poles
    Carbon contact point
    Yoke and ferrite
    Semiconductor elements
    Ceramics and glass components, which cannot be soldered.


    Technical


    • Colour: Aluminium/Silver
    • Disassembly:
    • Reaction Type:
    • Viscosity: 110 Pa.s
    • Specific Gravity: 2.9
    • Skin Over Time:
    • Shore Harness:
    • Elongation:
    • Tensile Strength:
    • Shear Strength:
    • Pressure Resistance:
    • Effective Temperature Range:
    • Cured state:
    • Volume Resistivity: 5 x 10E-6 Ω.m
    • Dielectric breakdown strength:
    • Dielectric constant 1MHz:
    • Dissipation Factor 1MHz:
    • Thermal conductivity:
    • Fixture time:
    • Break loose torque:
    • Prevailing torque:
    • Retaining Strength (Steel):
    • Max thread size or clearance:
    • Max clearance:
    • Tack free time:
    • Tack retain time:
    • Lap Shear Strength Steel:
    • Peel strength Steel:
    • Setting time Metal:
    • Setting time Rubber:
    • Strength:
    • Binder:
    • Solvent:
    • Substrates:
    • Curing Conditions: 120°C x 60 mins
    • Glass Transition Point (°C):
    • Pencil Hardness: 9H
    • Linear expansion coefficient ppm/°C::

    TB3301

    • Product Information
    • Product Information by Series
    • Product Information by Function
      • Automotive Fluid Resistance
      • White Label MSDS
      • Hard to Bond Surfaces
      • Highly Peelable and Shock Resistant
      • High Heat Resistance
      • Heat Dissipation
      • Flame Retardant
      • Low Outgassing
    • Product Information by Application
      • Gasketing
      • Powertrain Sealing
      • Thread Sealing
      • Threadlocking/Retaining
      • Instant Bonding
      • Structural Bonding
      • Flexible Bonding
      • Magnet Bonding
      • Electronics Bonding/Sealing
      • Potting/Encapsulation
      • Light Cure Adhesive
      • Electroconductive Adhesive
      • Surface Preparation/Protection
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