↓ Skip to Main Content
ThreeBond
Creating Our Future From a Single Drop
ThreeBond Europe
Japanese Site
  • Site Map
A- A- A+
  • Home
  • Company Information
    • About ThreeBond
    • Founding Principles
    • Company Profile
    • Partnership in Sales and Research & Development
    • ThreeBond Network
    • Global Locations
  • Product Information
    • Product Information by Series
    • Product Information by Function
      • Automotive Fluid Resistance
      • White Label MSDS
      • Hard to Bond Substances
      • Highly Peelable and Shock Resistant
      • High Heat Resistance (High Tg)
      • Heat Dissipation
      • Low Halogen
      • Low Moisture Permeability
      • Flame Reatrdant
      • CIPG
      • Low Outgassing
    • Product Information by Application
      • Gasketing
      • Powertrain Sealing
      • Threadlocking / Retaining
      • Threadsealing
      • Electronics Bonding / Sealing
      • Structural Bonding
      • Instant Bonding
      • Flexible Bonding
      • Potting / Encapsulation
      • Surface Preparation / Protection
      • Light Cure Adhesive
      • Electroconductive Adhesive
  • Technical Information
    • Technical News
    • Latest Information on Technology and Material
      • Heat Dissipation and Heat Conduction
      • Fast Curing, Heat Source Removal
      • Oily Surface Adhesion
      • Halogen Free
      • Flame Retardant
      • Hard to Bond
    • Seminars on Adhesives
      • About basics of adhesion
      • About Anaerobic Adhesives
      • About Instant Adhesives
      • About Elastic Adhesives
      • About UV Curing Resins
      • About Pre-Coated Bolts
      • About Epoxy Resins
      • About Liquid Gaskets
  • Social & Environmental Activities
    • Quality Management
    • Environmental Management
    • Green Procurement
    • Special Olympics
    • Sports Sponsorship
  • Contact Us
    • Contact Threebond Europe
    • ThreeBond Europe Locations
    • Distributors
    • Sitemap
Home › Products › TB3301F

Product Information - TB3301F

TB3301F



Click to expand

TB3301F is an electroconductive adhesive of single fluid, thermosetting type, characterised
by quick hardening at elevated temperature. In contrast to solder, strong adhesion is provided for
plastic, rubber and ceramic. Applicable to bonding of lead wire to electrodes.

Product Information


Product NumberSeriesProduct TypeApplication(s)Other Features
TB3301F 3300 seriesAdhesives
  • Electroconductive Adhesives
  • Electronics Bonding/Sealing
  • Low Outgassing

Features



General bonding
For spot and plane bonding
Solvent type
Low out gassing type
Applications
Lead wire of electronic components and electronic poles
Fixing quartz oscillator parts


Technical


  • Colour: Aluminium/Silver
  • Disassembly:
  • Reaction Type:
  • Viscosity: 23 Pa.s
  • Specific Gravity:
  • Skin Over Time:
  • Shore Harness:
  • Elongation:
  • Tensile Strength:
  • Shear Strength: 12.0 MPa
  • Pressure Resistance:
  • Effective Temperature Range:
  • Cured state:
  • Volume Resistivity: 1~2 x 10E-6 Ω.m
  • Dielectric breakdown strength:
  • Dielectric constant 1MHz:
  • Dissipation Factor 1MHz:
  • Thermal conductivity:
  • Fixture time:
  • Break loose torque:
  • Prevailing torque:
  • Retaining Strength (Steel):
  • Max thread size or clearance:
  • Max clearance:
  • Tack free time:
  • Tack retain time:
  • Lap Shear Strength Steel:
  • Peel strength Steel:
  • Setting time Metal:
  • Setting time Rubber:
  • Strength:
  • Binder:
  • Solvent:
  • Substrates:
  • Curing Conditions:
  • Glass Transition Point (°C):
  • Pencil Hardness:
  • Linear expansion coefficient ppm/°C::

TB3301F

  • Product Information
  • Product Information by Series
  • Product Information by Function
    • Automotive Fluid Resistance
    • White Label MSDS
    • Hard to Bond Surfaces
    • Highly Peelable and Shock Resistant
    • High Heat Resistance
    • Heat Dissipation
    • Flame Retardant
    • Low Outgassing
  • Product Information by Application
    • Gasketing
    • Powertrain Sealing
    • Thread Sealing
    • Threadlocking/Retaining
    • Instant Bonding
    • Structural Bonding
    • Flexible Bonding
    • Magnet Bonding
    • Electronics Bonding/Sealing
    • Potting/Encapsulation
    • Light Cure Adhesive
    • Electroconductive Adhesive
    • Surface Preparation/Protection
  • Home
  • Company Information
  • Product Information