IC in smartphones : the role of sealants
13/10/2025
Modern smartphones are marvels of miniaturization, packing incredible computing power into a pocket-sized device. At the heart of these devices are Integrated Circuits (ICs), the tiny electronic brains that make everything possible : from gaming to video calls. While ICs are small, their impact is massive, and they need careful attention to stay cool and functional. This is where sealants and adhesives come into play.
What is an IC ?
An Integrated Circuit (IC) is a compact assembly of electronic components, such as transistors, resistors, and capacitors, built onto a single semiconductor chip. In a smartphone, ICs handle a variety of critical functions, from processing data and managing power to enabling wireless communication. The most common ICs include the CPU, GPU, memory chips, and power management ICs.
These chips work around the clock to run apps, support multitasking, and keep the device responsive. But all this activity generates heat, and if it’s not managed properly, it can reduce performance, shorten battery life, and even cause long-term damage to the components.
Why is Heat Dissipation Critical ?
ICs, like tiny engines, produce heat as a byproduct of electrical activity. If the heat isn’t properly managed, the chip can overheat, leading to :
- Throttling : reduced performance to prevent damage.
- Component failure : Long-term exposure to high temperatures can degrade semiconductors.
- Battery issues : excess heat can reduce battery efficiency and lifespan.
Smartphones use a combination of thermal pads, metal heat spreaders, and specialized adhesives to manage this heat. These materials help transfer heat away from the ICs to the phone’s body, ensuring stable performance even during intensive tasks like gaming or 4K video recording.
Sealants roles
Sealants and adhesives in smartphones aren’t just for holding components together, they also play a vital role in heat management and protection.
- Thermal Conductive Adhesives : These adhesives bond ICs to heat sinks or metal frames, facilitating efficient heat transfer away from the chip.
- Encapsulants and Sealants : Applied over ICs, they protect sensitive electronics from moisture, dust, and mechanical stress, while also distributing heat evenly.
- Gap Fillers : For uneven surfaces, thermally conductive fillers fill spaces between ICs and cooling surfaces, enhancing heat dissipation.
Applications of these materials include :
- Bonding the CPU or GPU to metal plates for faster heat transfer.
- Die bonding : process of attaching a semiconductor die (the tiny slice of silicon containing the actual IC circuitry) to a substrate or package. Essentially, it’s the step that physically mounts the chip onto the part of the device that will connect it to the rest of the electronics.
- Protecting ICs in the camera module or power management circuits from environmental stress.
- Improving durability in smartphones exposed to drops, vibrations, and high-temperature environments.
In short, without the smart use of sealants and adhesives, ICs could overheat, making it difficult for smartphones to stay slim while delivering top performance. These materials work quietly behind the scenes to keep your device cool, reliable, and durable. That’s why selecting the right sealants is such an important consideration when designing or working with electronic devices.
Features
TB1225 Series
Heat conductive RTV Silicones
- High thermal conductivity (1,59 to 2,5W/m.K),
- Low molecular weight cyclic siloxane reduced product
Viscosity
18, 70 Pa.s
Colour
White, Gray
Hardness
A74, A81 (Shore)
Service temperature
-60 to +200°C
TB3331D
Epoxy based Heat curing Electrically Conductive Adhesive
- Curing at 80°C x 60 min,
- Low resistance value,
- High reliability
- Low halogen
Viscosity
180 Pa.s
Colour
Silver
Service temperature
-40 to +150°C
