3300 Series
Electro-conductive adhesives
Designed for electronics, automotive, EV, semiconductor and precision manufacturing industries, the 3300 Series offers solutions for PCB assembly, conductive bonding, crystal oscillator assembly, grounding, circuit repair and anisotropic conductive bonding (ACP). With formulations ranging from room-temperature curing to heat-curing systems, the series enables manufacturers to replace or complement traditional soldering while improving design flexibility and production efficiency.
Applications
Products
21 products — filter & search
21 products
| Product | Type | Features | Applications | Appearance | Viscosity |
|---|---|---|---|---|---|
3301F |
Epoxy silver filled Heat curing resin |
Electro-conductive | Electroconductive bonding of electronic components | Silver |
23 Pa.s |
3301M |
Epoxy silver filled Heat curing resin |
Electro-conductive | Electroconductive bonding of electronic components | Silver |
67 Pa.s |
3301W |
Epoxy silver filled Heat curing resin |
Electro-conductive | Electroconductive bonding of electronic components | Silver |
37 Pa.s |
3302B |
Urethane silver filled Heat curing resin |
Electro-conductive | Developed for crystal oscillators and other electronic parts | Silver |
15 Pa.s |
3303B |
Silicone silver filled Heat curing resin |
Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts |
Light yellow |
22 Pa.s |
3303G Neo |
Silicone silver filled Heat curing resin |
Electro-conductive | For connecting electrodes for small quartz crystals, crystal oscillators and surface acoustic wave filter in piezoelectric elements Fixing point bonding and chip parts |
Silver |
40 Pa.s |
3303M |
Silicone silver filled Heat curing resin |
Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components |
Light yellow |
40 Pa.s |
3303N |
Silicone silver filled Heat curing resin |
Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components |
Light yellow |
41 Pa.s |
3303R |
Silicone silver filled Heat curing resin |
Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts |
Light yellow |
50 Pa.s |
3304J |
Silicone silver filled Heat curing resin |
Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter, adhesion of points and fixation of chip parts Crystal device fixing |
Silver |
80 Pa.s |
3315E |
Solvent based synthetic rubber carbon filled Drying resin |
Electro-conductive Forms a flexible electroconductive film |
Electroconductive bonding of paper feed anti-static rollers and core bars of copying machines Grounding of electronic components |
Black |
600 mPa.s |
3331D |
Epoxy silver filled Heat curing resin |
Electro-conductive Fast cure at low temperature |
Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding |
Silver |
25 Pa.s |
3333F |
Silicone silver filled Heat curing resin |
Electro-conductive High stretching properties |
Ensuring of continuity of bent, stretched and sliding parts Grounding Electromagnetic wave shielding |
Brown |
20 Pa.s |
3350B |
Solvent based acrylic silver filled Drying resin |
Electro-conductive Cures at room temperature |
Spot bonding Screw conductive locking Circuit repair Electromagnetic wave |
Silver |
2.5 Pa.s |
3350C |
Solvent based acrylic silver filled Drying resin |
Electro-conductive Cures at room temperature |
Spot bonding Screw conductive locking Circuit repair Electromagnetic wave |
Silver |
1 Pa.s |
3351C |
Solvent based acrylic nickel filled Drying resin |
Electro-conductive Cures at room temperature Halogen free |
Developed for various electronic devices and components, securing continuity at coating films and spot-welded joints, grounding of electronic parts | Grey |
3 Pa.s |
3373C |
Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable |
Developed for FPCBs | Light yellowish green |
81 Pa.s |
3373F |
Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable |
Bonding and connecting of touch panels and FPCs Bonding and connecting of membrane switches Bonding and connecting of EL backlight terminals |
Greyish white |
60 Pa.s |
3374 |
Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable Solvent free |
Electrical connection Bonding between electrical circuits Flip chip |
Greyish brown |
140 Pa.s |
3380 |
Two-Part Epoxy silver filled heat curing resin | Electro-conductive (Silver) | Electroconductive bonding of electronic components | Silver |
(1 : 1) 70 : 120 Pa.s |
3381 |
Two-Part Epoxy nickel filled heat curing resin | Electro-conductive (Nickel) | Electroconductive bonding of electronic components | Black |
(1 : 1) 100 : 90 Pa.s |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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F.A.Q
01. What is an electrically conductive adhesive?
An electrically conductive adhesive is a polymer-based adhesive filled with conductive particles such as silver, nickel or carbon. It provides both mechanical bonding and electrical conductivity, making it suitable for electronic assemblies, grounding and circuit interconnections.
02. Can conductive adhesives replace soldering?
In many applications, yes. Conductive adhesives offer an alternative where soldering may not be suitable, particularly for heat-sensitive components, flexible substrates or assemblies requiring lower processing temperatures. The appropriate solution depends on the electrical, mechanical and environmental requirements of the application.
03. What conductive fillers are used in the ThreeBond 3300 Series?
The series includes formulations containing:
- Silver
- Nickel
- Carbon
04. What is the difference between isotropic and anisotropic conductive adhesives?
Isotropic conductive adhesives conduct electricity in all directions (X, Y and Z), making them suitable for general conductive bonding.
Anisotropic Conductive Pastes (ACP) conduct electricity only through the thickness (Z-axis), allowing adjacent conductive tracks to remain electrically isolated. They are widely used in LCDs, touch panels and flexible printed circuits.
Anisotropic Conductive Pastes (ACP) conduct electricity only through the thickness (Z-axis), allowing adjacent conductive tracks to remain electrically isolated. They are widely used in LCDs, touch panels and flexible printed circuits.
05. Can conductive adhesives provide EMI shielding?
Yes. Certain electrically conductive adhesives are specifically designed for electromagnetic interference (EMI) shielding and grounding applications, helping protect sensitive electronic devices from electromagnetic disturbances.
06. Are conductive adhesives suitable for automated production?
Yes. Many products in the ThreeBond 3300 Series are compatible with automated dispensing equipment, supporting high-volume manufacturing while ensuring consistent adhesive application and reliable electrical performance.
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