3300 Series
Electro-conductive adhesives
The 3300 Series is a range of advanced conductive adhesives, specially formulated for high-performance applications in various industries. Comprising synthetic resins combined with conductive fillers such as silver, nickel, or carbon, these adhesives provide strong and reliable bonding on a wide range of materials, including plastic, rubber, and ceramic.
The ThreeBond 3300 Series is widely used in critical processes such as:
- PCB Production — Secure and reliable bonding for printed circuits, ensuring optimal performance and durability.
- Wire Leads to Electrodes — Strong conductive properties ideal for connecting wire leads to electrodes.
- Semiconductor & EMI Parts Bonding — Securely bonds semiconductor elements and EMI parts for high-tech devices.
The series also includes anisotropically conductive adhesives (ACP) designed for high-density, multiterminal circuits such as LCD assembly, ensuring precise bonding without sacrificing reliability.
21 products — filter & search
21 products
| Product | Type | Features | Applications | Appearance | Viscosity |
|---|---|---|---|---|---|
3301F | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 23 Pa.s |
3301M | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 67 Pa.s |
3301W | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 37 Pa.s |
3302B | Urethane silver filled Heat curing resin | Electro-conductive | Developed for crystal oscillators and other electronic parts | Silver | 15 Pa.s |
3303B | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts | Light yellow | 22 Pa.s |
3303G Neo | Silicone silver filled Heat curing resin | Electro-conductive | For connecting electrodes for small quartz crystals, crystal oscillators and surface acoustic wave filter in piezoelectric elements Fixing point bonding and chip parts | Silver | 40 Pa.s |
3303M | Silicone silver filled Heat curing resin | Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components | Light yellow | 40 Pa.s |
3303N | Silicone silver filled Heat curing resin | Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components | Light yellow | 41 Pa.s |
3303R | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts | Light yellow | 50 Pa.s |
3304J | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter, adhesion of points and fixation of chip parts Crystal device fixing | Silver | 80 Pa.s |
3315E | Solvent based synthetic rubber carbon filled Drying resin | Electro-conductive Forms a flexible electroconductive film | Electroconductive bonding of paper feed anti-static rollers and core bars of copying machines Grounding of electronic components | Black | 600 mPa.s |
3331D | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding | Silver | 25 Pa.s |
3333F | Silicone silver filled Heat curing resin | Electro-conductive High stretching properties | Ensuring of continuity of bent, stretched and sliding parts Grounding Electromagnetic wave shielding | Brown | 20 Pa.s |
3350B | Solvent based acrylic silver filled Drying resin | Electro-conductive Cures at room temperature | Spot bonding Screw conductive locking Circuit repair Electromagnetic wave | Silver | 2.5 Pa.s |
3350C | Solvent based acrylic silver filled Drying resin | Electro-conductive Cures at room temperature | Spot bonding Screw conductive locking Circuit repair Electromagnetic wave | Silver | 1 Pa.s |
3351C | Solvent based acrylic nickel filled Drying resin | Electro-conductive Cures at room temperature Halogen free | Developed for various electronic devices and components, securing continuity at coating films and spot-welded joints, grounding of electronic parts | Grey | 3 Pa.s |
3373C | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable | Developed for FPCBs | Light yellowish green | 81 Pa.s |
3373F | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable | Bonding and connecting of touch panels and FPCs Bonding and connecting of membrane switches Bonding and connecting of EL backlight terminals | Greyish white | 60 Pa.s |
3374 | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable Solvent free | Electrical connection Bonding between electrical circuits Flip chip | Greyish brown | 140 Pa.s |
3380 | Two-Part Epoxy silver filled heat curing resin | Electro-conductive (Silver) | Electroconductive bonding of electronic components | Silver | (1 : 1) 70 : 120 Pa.s |
3381 | Two-Part Epoxy nickel filled heat curing resin | Electro-conductive (Nickel) | Electroconductive bonding of electronic components | Black | (1 : 1) 100 : 90 Pa.s |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.