2200 Series
One-component epoxy resins
This series offers a variety of formulations, including a high-peel-adhesive-strength type, providing exceptional bonding strength and durability. Whether for insulation, protection, or bonding, the ThreeBond 2200 Series delivers the reliability and performance necessary for today's cutting-edge electrical and electronic components.
Applications
Products
87 products — filter & search
87 products
| Product | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
2202 |
Epoxy resin Heat curing |
Cures at low temperature (from 60°C) |
Potting, fixing and sealing electronic components Case sealing Connector sealing, potting |
Black |
13 Pa.s | -40 to +120°C |
2202C |
Epoxy resin Heat curing |
Cures at low temperature (from 70°C) ISO10993 certified |
Potting, fixing and sealing electronic components Case sealing Connector sealing, potting Bonding of needle and needle hub, securing of lenses and tip parts |
White |
27 Pa.s | -40 to +120°C |
2202P |
Epoxy resin Heat curing |
Cures at low temperature Low outgasing |
Potting, fixing and sealing electronic components | Purple |
13 Pa.s | -40 to +120°C |
2204 |
Epoxy resin Heat curing |
Cures at low temperature (from 60°C) |
Potting, fixing and sealing electronic components | Black |
28 Pa.s | -40 to +120°C |
2206 |
Epoxy resin Heat curing |
Cures at low temperature Good peel strength |
Fixing and sealing electronic components | Black |
120 Pa.s | -40 to +120°C |
2206C |
Epoxy resin Heat curing |
Cures at low temperature | Fixing and sealing electronic components | White |
70 Pa.s | -40 to +120°C |
2206D |
Epoxy resin Heat curing |
Cures at low temperature (from 70°C) |
Fixing and sealing electronic components | Beige |
60 Pa.s | -40 to +120°C |
2206F |
Epoxy resin Heat curing |
Cures at low temperature | Fixing and sealing electronic components | Orange |
85 Pa.s | -40 to +120°C |
2206S |
Epoxy resin Heat curing |
Cures at low temperature Low halogen |
Potting, fixing and sealing electronic components | Black |
15 Pa.s | -40 to +120°C |
2206U |
Epoxy resin Heat curing |
Cures at low temperature Low halogen |
Fixing and sealing electronic components | Black |
40 Pa.s | -40 to +110°C |
2206V |
Epoxy resin Heat curing |
Cures at low temperature Low halogen |
Fixing and sealing electronic components | Black |
52 Pa.s | -40 to +120°C |
2210 |
Epoxy resin Heat curing |
Cures at low temperature (from 80°C) Low exothermicity |
Potting, fixing and sealing electronic components | Black |
10 Pa.s | -40 to +110°C |
2210C |
Epoxy resin Heat curing |
Reduced separation | Potting, fixing and sealing electronic components | Black |
8 Pa.s | — |
2210K |
Epoxy resin Heat curing |
Cures at low temperature | Potting, fixing and sealing electronic components | Black |
3,5 Pa.s | -40 to +100°C |
2210S |
Epoxy resin Heat curing |
Cures at low temperature Low halogen |
Potting, fixing and sealing electronic components | Black |
8 Pa.s | -40 to +100°C |
2212 |
Epoxy resin Heat curing |
High penetrability and flowability | Potting, fixing and sealing electronic components | Black |
13 Pa.s | -40 to +110°C |
2212B |
Epoxy resin Heat curing |
High moisture resistance | Potting, fixing and sealing electronic components | Black |
25 Pa.s | -40 to +120°C |
2212C |
Epoxy resin Heat curing |
High moisture resistance | Potting, fixing and sealing electronic components | Black |
25 Pa.s | — |
2212E |
Epoxy resin Heat curing |
Medium flowability Glossy aspect |
Potting, fixing and sealing electronic components | Black |
35 Pa.s | — |
2212Q |
Epoxy resin Heat curing |
Low halogen content | Potting, fixing and sealing electronic components | Black |
15 Pa.s | -40 to +120°C |
2215 |
Epoxy resin Heat curing |
Padding ability Glossy aspect |
Fixing and sealing electronic components | Black |
80 Pa.s | -40 to +100°C |
2215D |
Epoxy resin Heat curing |
Reduced separation | Fixing and sealing electronic components | Black |
140 Pa.s | -40 to +120°C |
2217 |
Epoxy resin Heat curing |
Screen printable | Surface mount adhesive (SMA) for wave soldering process | Rust |
265 Pa.s | -40 to +130°C |
2217H |
Epoxy resin Heat curing |
High thixotropic grade Fast curing |
Surface mount adhesive (SMA) for wave soldering process | Pink |
185 Pa.s | -40 to +120°C |
2217L |
Epoxy resin Heat curing |
High thixotropic grade Fast curing |
Surface mount adhesive (SMA) for wave soldering process | Pink |
— | -40 to +120°C |
2219C |
Epoxy resin Heat curing |
Low flow while curing | Fixing and sealing electronic components | Black |
250 Pa.s | -40 to +100°C |
2221D |
Epoxy resin Heat curing |
— | Fixing and sealing electronic components | Rust |
13 Pa.s | -40 to +130°C |
2222P |
Epoxy resin Heat curing |
Solder resistant | Fixing and sealing electronic components Magnet bonding |
Black |
45 Pa.s | -40 to +130°C |
2222R |
Epoxy resin Heat curing |
Solder resistant Low CTE |
Fixing and sealing electronic components | Black |
65 Pa.s | — |
2222W |
Epoxy resin Heat curing |
Good adhesion on glass and metals | — | — |
— | — |
2223S |
Epoxy resin Heat curing |
Stable flowability | Potting, fixing and sealing electronic components Sealing and potting of relay terminals |
Black |
43 Pa.s | -40 to +130°C |
2224 |
Epoxy resin Heat curing |
High solder resistance | Potting, fixing and sealing electronic components | — |
— | -40 to +130°C |
2224D |
Epoxy resin Heat curing |
High solder resistance | Potting, fixing and sealing electronic components | — |
— | -40 to +130°C |
2225G |
Epoxy resin Heat curing |
— | For relay sealing | Black |
50 Pa.s | — |
2230 |
Epoxy resin Heat curing |
Low viscosity grade | Potting, fixing and sealing electronic components | Black |
8 Pa.s | — |
2230B |
Epoxy resin Heat curing |
Good peel strength | Potting, fixing and sealing electronic components | Black |
8 Pa.s | -40 to +120°C |
2232 |
Epoxy resin Heat curing |
Good heat resistance | Potting, fixing and sealing electronic components | White |
27 Pa.s | -40 to +120°C |
2232E |
Epoxy resin Heat curing |
Good mechanical properties | Potting, fixing and sealing electronic components | Black |
16 Pa.s | -40 to +120°C |
2233B |
Epoxy resin Heat curing |
Good flowability | Fixing and sealing electronic components | Black |
55 Pa.s | — |
2233K |
Epoxy resin Heat curing |
Good flowability | Potting, fixing and sealing electronic components | Black |
27 Pa.s | -40 to +150°C |
2233L |
Epoxy resin Heat curing |
Good flowability | Potting, fixing and sealing electronic components | Black |
20 Pa.s | -40 to +150°C |
2233Q |
Epoxy resin Heat curing |
Good flowability | Potting, fixing and sealing electronic components | Black |
20 Pa.s | -40 to +120°C |
2233R |
Epoxy resin Heat curing |
Good flowability | Potting, fixing and sealing electronic components | Black |
22 Pa.s | -40 to +150°C |
2234C |
Epoxy resin Heat curing |
Excellent flowability and heat resistance | Fixing and sealing electronic components General bonding |
Grey white |
110 Pa.s | — |
2234E |
Epoxy resin Heat curing |
Solder resistant and flowable | Fixing and sealing electronic components General bonding |
Black |
70 Pa.s | — |
2235L |
Epoxy resin Heat curing |
High heat resistance High Tg |
Fixing and sealing electronic components Magnet bonding Reactor coil heat dissipation Securing of tip parts Bonding of needle and needle hub |
Black |
80 Pa.s | -40 to +160°C |
2235N |
Epoxy resin Heat curing |
Good mechanical properties | General bonding | Black |
100 Pa.s | -40 to +150°C |
2235P |
Epoxy resin Heat curing |
Good mechanical properties Thixotropic |
Fixing and sealing electronic components | Black |
65 Pa.s | -40 to +120°C |
2236 |
Epoxy resin Heat curing |
Excellent flowability Excellent metal adhesion |
Coating of motor coil Fixing and sealing electronic components |
Grey white |
120 Pa.s | -40 to +120°C |
2237J |
Epoxy resin Heat curing |
High heat resistance High Tg, low CTE |
Fixing and sealing electronic components Magnet bonding Reactor coil heat dissipation |
White |
115 Pa.s | -40 to +160°C |
2237K |
Epoxy resin Heat curing |
Low halogen content Screen printable |
Fixing and sealing electronic components | White |
63 Pa.s | — |
2239H |
Epoxy resin Heat curing |
Low CTE | — | White |
— | — |
2239M |
Epoxy resin Heat curing |
Strong adhesion | General bonding | Grey |
510 Pa.s | — |
2239N |
Epoxy resin Heat curing |
Strong adhesion | General bonding Bonding of yokes and ferrites |
Green grey |
510 Pa.s | -40 to +120°C |
2239P |
Epoxy resin Heat curing |
Strong adhesion | General bonding Bonding of yokes and ferrites |
Green grey |
230 Pa.s | -40 to +120°C |
2242 |
Epoxy resin Heat curing |
— | Fixing and sealing electronic components | — |
— | -40 to +100°C |
2247D |
Epoxy resin Heat curing |
Strong adhesion | Bonding of motor magnets, various metals and plastics | White |
45 Pa.s | -40 to +120°C |
2249G |
Epoxy resin Heat curing |
High peel strength Excellent adhesion to metals |
Fixing and sealing electronic components General bonding |
Black |
75 Pa.s | -40 to +120°C |
2249K |
Epoxy resin Heat curing |
High peel strength Excellent adhesion to metals |
General bonding | Black |
882 Pa.s | -40 to +120°C |
2252 |
Epoxy resin Heat curing |
High peel strength | — | Black |
24 Pa.s | — |
2253G |
Epoxy resin Heat curing |
Flexibility | — | Yellow |
37 Pa.s | — |
2263B |
Epoxy resin Heat curing |
Low specific gravity | — | Black |
111 Pa.s | — |
2270C |
Epoxy resin Heat curing |
Heat conductive (0,9W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material Reactor coil heat dissipation |
Grey |
140 Pa.s | -40 to +150°C |
2270J |
Epoxy resin Heat curing |
Heat conductive (4,2W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material |
White |
117 Pa.s | -40 to +120°C |
2271J |
Epoxy resin Heat curing |
Snap cure | Die attach Non Conductive Paste (NCP) |
Yellowish white |
15 Pa.s | -40 to +120°C |
2272F |
Epoxy resin Heat curing |
UL94-V0 certified | Fixing and sealing electronic components | Black |
117 Pa.s | -40 to +130°C |
2272H |
Epoxy resin Heat curing |
UL94-V0 certified | Fixing and sealing electronic components | Black |
105 Pa.s | -40 to +120°C |
2273D |
Epoxy resin Heat curing |
Compatible with fast induction curing process | Potting, fixing and sealing electronic components Magnet bonding |
White |
75 Pa.s | -40 to +130°C |
2273E |
Epoxy resin Heat curing |
Compatible with fast induction curing process | Potting, fixing and sealing electronic components Magnet bonding |
White |
80 Pa.s | -40 to +130°C |
2273F |
Epoxy resin Heat curing |
Compatible with fast induction curing process | Potting, fixing and sealing electronic components Magnet bonding |
White |
75 Pa.s | -40 to +130°C |
2273J |
Epoxy resin Heat curing |
Compatible with fast induction curing process | Potting, fixing and sealing electronic components Magnet bonding |
White |
66 Pa.s | -40 to +130°C |
2274B |
Epoxy resin Heat curing |
Low viscosity High capillary flow property |
Chip reinforcement Underfill agent for BGAs and CSPs |
Black |
4.7 Pa.s | -40 to +100°C |
2274E |
Epoxy resin Heat curing |
Low viscosity High capillary flow property |
Chip reinforcement Underfill agent for BGAs and CSPs |
White |
3.5 Pa.s | -40 to +120°C |
2274S |
Epoxy resin Heat curing |
Low viscosity High capillary flow property |
Chip reinforcement Underfill agent for BGAs and CSPs |
Blue |
3.8 Pa.s | -40 to +130°C |
2280C |
Epoxy resin Heat curing |
Low exothermicity | Fixing and sealing electronic components General bonding |
Light brown |
125 Pa.s | -40 to +150°C |
2280E |
Epoxy resin Heat curing |
Low exothermicity | Fixing and sealing electronic components General bonding |
Black |
125 Pa.s | -40 to +150°C |
2280H |
Epoxy resin Heat curing |
Film forming adhesive Good heat resistance Expandable resin |
Magnet bonding of IPM motors | Black |
11 Pa.s | -40 to +150°C |
2280K |
Epoxy resin Heat curing |
Film forming adhesive Good heat resistance Expandable resin |
Magnet bonding of IPM motors | — |
— | — |
2284E |
Epoxy resin Heat curing |
— | Rotor's balance by addition | Rust |
120 Pa.s | — |
2285D |
Epoxy resin Heat curing |
High heat resistance High Tg |
Fixing and sealing electronic components Magnet bonding |
White |
180 Pa.s | -40 to +180°C |
2285J |
Epoxy resin Heat curing |
High adhesion on rare earth magnet materials | Magnet bonding of IPM motors | Greyish white |
225 Pa.s | -40 to +160°C |
2286D |
Epoxy resin Heat curing |
— | Coil impregnation Fixing to prevent disconnection of motor coil |
White |
330 Pa.s | -40 to +150°C |
2286G |
Epoxy resin Heat curing |
— | Coil impregnation Fixing to prevent disconnection of motor coil |
Pink |
325 Pa.s | — |
2286L |
Epoxy resin Heat curing |
— | Coil impregnation Fixing to prevent disconnection of motor coil |
White |
590 Pa.s | — |
2286T |
Epoxy resin Heat curing |
— | Coil impregnation Fixing to prevent disconnection of motor coil |
White |
1800 Pa.s | — |
2286U |
Epoxy resin Heat curing |
— | Coil impregnation Fixing to prevent disconnection of motor coil |
White |
1150 Pa.s | — |
2287 |
Epoxy resin Heat curing |
— | Laminated core impregnation | Rust |
120 mPa.s | — |
2287D |
Epoxy resin Heat curing |
— | Fixing coils | Brown |
25 Pa.s | — |
2287F |
Epoxy resin Heat curing |
— | Laminated core impregnation | Rust |
150 Pa.s | -40 to +150°C |
2295 |
Epoxy resin Heat curing |
Halogen free Low ionic content |
Potting, fixing and sealing electronic components | Black |
25 Pa.s | -40 to +150°C |
2296B |
Epoxy resin Heat curing |
Fast cure at low temperature (from 60°C) Thixotropic Excellent shape retention |
Camera module components bonding FPC reinforcement Flat spring and magnet fixing Fixing diffusing lens |
Black |
18.5 Pa.s | -40 to +100°C |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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F.A.Q
01. What is a one-component epoxy resin?
One-component epoxy resins are pre-mixed adhesives that cure when heated. Unlike two-component epoxies, they do not require mixing before application, making them ideal for automated manufacturing processes.
02. What are one-component epoxy resins used for?
They are commonly used for electronic potting, component bonding, connector sealing, underfill, magnet bonding, coil impregnation and protection of sensitive electrical assemblies.
03. Why choose a one-component epoxy instead of a two-component epoxy?
One-component epoxy resins offer easier processing, consistent mixing ratios, improved automation and reduced risk of mixing errors.
04. Can the 2200 Series be used for electronic potting?
Yes. Many products in the series are specifically formulated for potting and encapsulation applications, providing insulation and protection against moisture, chemicals and vibration.
05. What is underfill?
Underfill is an epoxy material applied beneath semiconductor packages such as BGAs and CSPs to improve mechanical strength and thermal cycling reliability.
06. Are there heat conductive epoxy resins in the 2200 Series?
Yes. The range includes thermally conductive formulations designed to improve heat dissipation in electronic components.
07. What curing temperatures are available?
Depending on the product, curing can begin from approximately 60°C, allowing faster processing while protecting temperature-sensitive components.
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