#Electric Control Unit (ECU)
With rising competition, strict regulations, and rapidly evolving technology, the demand for reliable polymer adhesive formulations in automotive electronics has never been greater. At ThreeBond, we offer a diverse range of products designed to meet the high-performance needs of this market. Our solutions support critical applications such as heat dissipation, electrical conduiting, case sealing, connector potting, and protective coatings, ensuring durability and efficiency in automotive electronics.Electronic Control Units (ECUs) are critical components in modern vehicles and industrial machinery, requiring robust protection against environmental factors such as moisture, dust, and vibrations. ThreeBond offers advanced sealing solutions designed to enhance the durability and reliability of ECUs. Whether it’s sealing and bonding the case with FIPG or CIPG, applying a protective coating to the substrate, ensuring efficient heat dissipation, enhancing conductivity, or securing screws : explore our range of products designed for every application below !
19 products — filter & search
| Product | Type | Features | Applications | Appearance | Viscosity | Service temp. |
|---|---|---|---|---|---|---|
1160 1100 | Acryl rubber Moisture curing sealant | Tin free
Siloxane free Paintable sealant Heat and cold resistance ATF and oils resistance | Sealing of various parts | Black | 125 Pa.s | -40 to +120°C |
1207B 1200 | RTV Silicone (Acetone) Moisture curing sealant | Good oil and LLC resistance UL94-HB certified | FIPG: Engine oil and coolant sealing | Black | 100 Pa.s | -60 to +200°C (+250°C) |
1217P 1200 | RTV Silicone (Oxime) Moisture curing sealant | MEKO Free | Engine sealing | Black | 260 Pa.s | -60 to +200°C (+250°C) |
1217P 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (1,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Image sensor module heat dissipation | White | 18 Pa.s | -60 to +200°C (+250°C) |
1225C 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (2,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Cell heat radiation | Grey | 70 Pa.s | -60 to +200°C (+250°C) |
1226 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Good adhesion onto plastics | Electronic control unit sealing Light source control unit bonding Plastic case sealing | Grey | 97 Pa.s | -60 to +200°C (+250°C) |
1234B 1200 | Silicone Heat curing sealant | Excellent heat, moisture and water resistance | FIPG or CIPG Sealing electronics | Grey | 400 Pa.s | -60 to +200°C (+250°C) |
2202 2200 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components Case sealing Connector sealing, potting | Black | 13 Pa.s | -40 to +120°C |
2204 2200 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components | Black | 28 Pa.s | -40 to +120°C |
2270J 2200 | Heat conductive (4,2W/m.K) | Cures at low temperature (from 60°C) | Fixing and sealing electronic components TIM: Thermal Interface Material | White | 117 Pa.s | -40 to +120°C |
3013Q 3000 | Acrylate UV curing resin | Rubber elasticity Good heat and oil resistance | Good heat and oil resistance Connector sealing Potting for various electronic parts | Blue | 23 Pa.s | -40 to +120°C |
3013R 3000 | Acrylate UV curing resin | Good deep curing Good heat and moisture resistance Excellent chemical and mechanical resistance | Protective coating Encapsulation of connection contacts and electrical components, diodes, LEDs… Fixing of connection wires Selective coating of PCB | Light yellow | 10 Pa.s | -40 to +120°C |
3059D 3000 | Acrylate UV curing resin | Thixotropic Low outgassing | Fixing of wires of HDD head suspensions Adhesion and fixing of various electronic components | White | 80 Pa.s | - |
3064 3000 | Acrylate UV, Anaerobic and Primer curing resin | - | - | - | - | - |
3065E 3000 | Acrylate UV, Anaerobic and Primer curing resin | Adhesion to different materials | - | Light yellow | 7 Pa.s | - |
3075E 3000 | Acrylate UV curing resin | High flexibility | Clear insulating coating of of electronic parts | Clear | 20 Pa.s | - |
3081J 3100 | One-component solvent free acrylic resin | UV curing, rubber elasticity after curing, excellent shape retention before curing, low compression set ensures excellent seal | Cover panel adhesion, CIPG for electric, electronic and other electrical parts, elastic sealing application which requires heat and cold resistance | Transparent yellow | 95 Pa.s | -40 to +120°C |
3166 3100 | Silicone UV curing resin | CIPG : Cured In Place Gasket Ultra soft rubber Excellent heat and moisture resistance High shape retention | Case sealing of electrical and electronic parts Case and lens mount waterproofness and dustproofness | Blue | 330 Pa.s | -40 to +120°C |

Millimeter wave radar
Millimeter-wave radar technology plays a crucial role in advanced driver assistance systems (ADAS) and autonomous driving. To ensure optimal performance and durability, ThreeBond offers a range of solutions. Our high-performance materials help enhance reliability, protect against environmental factors, and maintain long-term functionality. Explore our specialized products designed for millimeter-wave radar applications !

Mirror
Corner sensors are essential components in modern vehicles and industrial systems, providing precise detection of objects and obstacles in hard-to-see areas. Commonly used in parking assistance, autonomous driving, and collision avoidance systems, these sensors enhance safety and maneuverability by detecting objects at the edges of vehicles or machinery.
ThreeBond offers high-performance adhesives and sealants designed to optimize corner sensor functionality. Our solutions ensure secure mounting, superior environmental resistance, and long-lasting durability. By protecting sensors against moisture, vibration, and extreme temperatures, ThreeBond materials enhance reliability and performance in demanding applications.