#Smartphones and tablets
At ThreeBond, we offer a wide range of specialized adhesives and sealants tailored for smartphones and tablets, including optically clear materials and electro-conductive adhesives. Designed to meet the precise specifications of mobile device manufacturers, our solutions help produce thinner, lighter, and more advanced devices.From touch screen and Organic EL panel bonding to electronic component assembly and BGA/CSP reinforcement, our adhesives support key applications to enhance the performance and functionality of modern smartphones and tablets.
14 products — filter & search
14 products
| Product | Type | Features | Applications | Appearance | Viscosity | Service temp. |
|---|---|---|---|---|---|---|
1225B 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (1.5 W/m.K) Low molecular siloxane content (LMW) | TIM: Thermal Interface Material Electrical and PCB components sealing Image sensor module heat dissipation | White | 18 Pa.s | -60 to +200°C (+250°C) |
1225C 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (2.5 W/m.K) Low molecular siloxane content (LMW) | TIM: Thermal Interface Material Electrical and PCB components sealing Cell heat radiation | Grey | 70 Pa.s | -60 to +200°C (+250°C) |
1357K 1300 | Acrylate resin Anaerobic adhesive | High strength Heat resistant Low halogen | Bonding of metallic part fitting areas Laminated core bonding Bearing fixing Vibrating motor Magnet bonding | Blue | 12 Pa.s | -40 to +175°C |
1539 1500 | Castor oil polymer Moisture and heat curing adhesive | Environment-friendly (plant-derived polymer) Excellent vibration and impact resistance Low temperature curing (60°C) | Bonding, sealing and potting of various materials Touch sensor bonding Connector sealing and bonding Gap filling between camera and case Cover panel adhesion | Black | 100 Pa.s | -35 to +100°C |
2206S 2200 | Epoxy resin Heat curing | Cures at low temperature Low halogen | Potting, fixing and sealing electronic components | Black | 15 Pa.s | -40 to +120°C |
2270J 2200 | Epoxy resin Heat curing | Heat conductive (4.2 W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material | White | 117 Pa.s | -40 to +120°C |
3020B 3000 | Acrylate UV curing resin | LED curing compatible Colored black after curing | Coating of exteriors of electrical and electronic components Coating and bonding of parts requiring masking effect Glass and resin lenses bonding LC panel end face coating Cover panel end face coating | Light yellow | 3.5 Pa.s | — |
3027G 3000 | Acrylate UV curing resin | LED curing compatible Low water absorption rate Good moisture resistance | For ITO molding | Light yellow | 2 Pa.s | — |
3027J 3000 | One-component solvent free acrylic resin UV-LED curing | Low halogen content Low water absorption rate Good moisture resistance | Cover panel end face coating | Black | 2.4 Pa.s | — |
3081J 3000 | Acrylate UV curing resin | CIPG for electric and electronic parts Low compression set | Electronics parts | Yellow clear | 95 Pa.s | — |
3166 3100 | Silicone UV curing resin | CIPG — Cured In Place Gasket Ultra soft rubber Excellent heat and moisture resistance High shape retention | Case sealing of electrical and electronic parts Case and lens mount waterproofness and dustproofness | Blue | 330 Pa.s | — |
3170B 3100 | Acrylate Visible light curing resin | Thick film curability | For optical parts Bonding and fixing IR cut-off filter | Light yellow | 1.8 Pa.s | — |
3304J 3300 | Silicone silver filled Heat curing resin | Electro-conductive | Connection of piezoelectric elements with electrodes of crystal units Crystal oscillator and surface wave elasticity filter Crystal device fixing | Silver | 80 Pa.s | — |
3331D 3300 | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding | Silver | 25 Pa.s | — |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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