#Sensor and MEMS device

Sensors and MEMS (Micro-Electro-Mechanical Systems) devices are essential components in modern electronics, enabling precise measurement of physical conditions such as motion, pressure, temperature, and humidity. These miniature devices are widely used in automotive, industrial, medical, and consumer electronics applications.

To ensure their durability and reliability, ThreeBond provides high-performance adhesives and sealants tailored for key applications such as sealing, die bonding, and potting. Our advanced sealing solutions protect sensitive MEMS and sensor components from moisture, dust, and contaminants. Die bonding adhesives secure the delicate semiconductor chips within MEMS devices, ensuring strong adhesion and long-term performance. Additionally, our potting materials provide robust encapsulation, shielding components from mechanical stress, vibrations, and harsh environmental conditions.

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3 products
ProductTypeFeaturesApplicationsAppearanceViscosityService temp.
2206S
2200
Epoxy resin
Heat curing
Cures at low temperature
Low halogen
Potting, fixing and sealing electronic components
Black
15 Pa.s-40 to +120°C
3013Q
3000
Acrylate
UV curing resin
Rubber elasticity
Good heat and oil resistance
Connector sealing
Potting for various electronic parts
Blue
23 Pa.s-
3331D
3300
Epoxy silver filled
Heat curing resin
Electro-conductive
Fast cure at low temperature
Grounding and conductive bonding of electronic components
Die attach
Electromagnetic wave shielding
Silver
25 Pa.s-
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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