#Cameras
ThreeBond provides specialized camera module or lenses adhesives used in the automotive, cellphone, and digital camera industries. The type of adhesive required varies based on the application, and we offer a range of solutions to meet these needs. Our products include low-temperature, fast-curing resins, as well as LED light-curable resins, ensuring high performance and precision across different camera module applications.
19 products — filter & search
19 products
| Product | Type | Features | Applications | Appearance | Viscosity | Service temp. |
|---|---|---|---|---|---|---|
1225B 1200 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (1,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Image sensor module heat dissipation | White | 18 Pa.s | -60 to +200°C (+250°C) |
1535 1500 | MS Polymer Moisture curing adhesive | "Solvent free Low odor Paintable Tin free" | Multi-purpose adhesive Potting and sealing of electronic parts Strobe periphery fixing, AF sensor fixing Attaching spindles to sponges, case sealing, connector sealing | White | 75 Pa.s | -40 to +120°C |
1539 1500 | Castor oil polymer Moisture and heat curing adhesive | Environment-friendly (plant-derived polymer) Excellent vibration and impact resistance Low temperature curing (60°C) | Bonding, sealing and potting of various materials Touch sensor bonding Connector sealing and bonding Gap filling between camera and case Cover panel adhesion | Black | 100 Pa.s | -35 to +100°C |
2206S 2200 | Epoxy resin Heat curing | Cures at low temperature Low halogen | Potting, fixing and sealing electronic components | Black | 15 Pa.s | -40 to +120°C |
2296B 2200 | Epoxy resin Heat curing | Fast cure at low temperature (from 60°C) Thixotropic Excellent shape retention | Camera module components bonding FPC reinforcement Flat spring and magnet fixing Fixing diffusing lens | Black | 18.5 Pa.s | -40 to +100°C |
2907D 2900 | Water-repellent Coating Agent | Contains silane compound, reacts with moisture in the air and forms a water-repellent film composed of siloxane, excellent water repellency and flex resistance | Top cover water repellent coating | Transparent light yellow | 1.5 mPa.s | +25°C |
3017 3000 | Acrylate UV curing resin | Low moisture permeability High peel strength | For difficult-to-bond materials (PET, PEN, PPS, …) | Clear yellow | 46 Pa.s | - |
3020B 3000 | Acrylate UV curing resin | LED curing compatible Colored black after curing | Coating of exteriors of electrical and electronic components Coating and bonding of parts requiring masking effect Glass and resin lenses bonding LC panel end face coating Cover panel end face coating | Light yellow | 3.5 Pa.s | - |
3030 3000 | Acrylate UV curing resin | LED curing compatible Low halogen content | Securing of PCB and component Lens fixing | White | 16.5 Pa.s | - |
3036 3000 | Acrylate UV curing resin | Low shrinkage Low CTE | For optical parts | White | 35 Pa.s | - |
3081J 3000 | Acrylate UV curing resin | CIPG; Cured In Place Gasket Excellent LLC resistance Low compression set Excellent shape retention | ECU, inverter, housing sealing | Light yellow | 95 Pa.s | - |
3114 3100 | Epoxy UV curing resin | Low shrinkage Low CTE | Bonding and securing of optical parts Suitable for precisely bonding and securing electronic parts Lens fixing Image sensor fixing | Grey white | 26 Pa.s | - |
3142 3100 | Epoxy UV and Heat curing resin | LED curing compatible Low shrinkage Excellent surface curability | Sealing, bonding, fixing, coating and potting of electronic components Image sensor active alignment Optical axis adjustment | White | 60 Pa.s | - |
3164D 3100 | Silicone UV and Moisture curing resin | Rubber elasticity High heat and cold resistance Low molecular siloxane content (LMW) | Sealing and bonding, fixing of electronic components Connector sealing | White | 10 Pa.s | -60 to +200°C |
3166 3100 | Silicone UV curing resin | CIPG : Cured In Place Gasket Ultra soft rubber Excellent heat and moisture resistance High shape retention | Case sealing of electrical and electronic parts Case and lens mount waterproofness and dustproofness | Blue | 330 Pa.s | - |
3168E 3100 | Silicone UV curing resin | Damping gel | Damping agent for optical pickups Image stabilizer unit, vibration absorption | Red | 90 Pa.s | - |
3170B 3100 | Acrylate Visible light curing resin | Thick film curability | For optical parts Bonding, fixing IR cut-off filter | Light yellow | 1.8 Pa.s | - |
3331D 3300 | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components
Die attach Electromagnetic wave shielding | Silver | 25 Pa.s | - |
3333F 3300 | Silicone silver filled Heat curing resin | Electro-conductive High stretching properties | Ensuring of continuity of bent, stretched and sliding parts
Grounding Electromagnetic wave shielding | Brown | 20 Pa.s | - |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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