Low outgassing
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#Low outgassing
In industries where contamination control is critical, ThreeBond’s low outgassing adhesives provide high-performance bonding while ensuring minimal release of volatile components. Designed for applications in electronics, optics, aerospace, and semiconductor manufacturing, these adhesives prevent fogging, maintain vacuum integrity, and protect sensitive components from unwanted deposits.
With excellent thermal stability, chemical resistance, and long-term reliability, ThreeBond’s low outgassing formulations meet the strictest industry standards, making them ideal for cleanroom environments and high-precision assemblies.
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| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1220H | De-alcohol type RTV silicone | Solvent free, non-sag, quick curing, excellent surface curability and thick film hardening, low-molecular siloxane | Electrical and PCB components sealing | White | 65 Pa.s | -60 to +200(250)°C |
| 1221H | De-alcohol type RTV silicone | Solvent free, low molecular siloxane content, excellent heat and cold resistance | Securing of PCB components, sealing of connectors, insulating sealing of electric apparatuses and moisture-proof coating of devices | White | - | -60 to +200(250)°C |
| 1530 | MS Polymer adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Multi-purpose adhesive | White | 100 mPa.s | -40 to +120°C (150°C) |
| 1530B | MS Polymer adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Multi-purpose adhesive | Black | 100 mPa.s | -40 to +120°C (150°C) |
| 1530C | MS Polymer adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Multi-purpose adhesive | Clear | 100 mPa.s | -40 to +120°C (150°C) |
| 1533 | MS Polymer adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Multi-purpose adhesive | White | 100 Pa.s | -40 to +120°C (150°C) |
| 1533C | MS Polymer adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Multi-purpose adhesive | Transparent | 100 Pa.s | -40 to +120°C (150°C) |
| 1537 | UL94V-0 certified | Non-solvent, moisture curing, low-molecular cyclic siloxane contents, low cure shrinkage | Bonding, sealing and potting of various parts | White | 55 Pa.s | -40 to +120°C (150°C) |
| 1537B | UL94V-0 certified | Non-solvent, moisture curing, low-molecular cyclic siloxane contents, low cure shrinkage | Bonding, sealing and potting of various parts | Black | 55 Pa.s | -40 to +120°C (150°C) |
| 1537D | UL94V-0 certified, MS polymer | Non-solvent, moisture curing, contains no plasticizers and no isocyanates, excellent weather resistance | Bonding of various parts | Grey | 55 Pa.s | -40 to +120°C (150°C) |
| 3001C | One-component solvent free acrylic resin | Solvent free acrylate, UV-LED curing, low visosity, high elasticity | Plexiglas/Plexiglas bonding, hard coating of keys Fixing of LCD pins, fixing of injection needles, temporary linking of electrical components, ecapsulating of connection contacts, balancing resins for motor rotors, fixing of connection wires, coating of printed circuit boards | Clear | 50 mPa.s | -40 to +120°C |
| 3301F | One-component electro-conductive epoxy resin | Epoxy silver filled resin, heat curing, low out-gassing type | Fixing quartz parts, pin bonding and surface bonding | Silver | 23 Pa.s | -40 to +120°C |
| 3380B | Two-component epoxy base resin | Good bonding strength with various metal materials, solvent free, low temperature curing | Bonding of electrical and electronic parts, which requires low outgas, bonding of chip and other aprts | Silver | 23 Pa.s | -40 to +120°C |
| 7721 | Low Blooming Cyanoacrylate Instant Adhesive (Gold Series) | Cyanoacrylate Ethyl, solvent free, moisture curing, low odor and low blooming, fast setting time | Bonding of various materials | Clear yellow | 5 mPa.s | -40 to +100°C |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
