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Low outgassing
In industries where contamination control is critical, ThreeBond’s low outgassing adhesives provide high-performance bonding while ensuring minimal release of volatile components. Designed for applications in electronics, optics, aerospace, and semiconductor manufacturing, these adhesives prevent fogging, maintain vacuum integrity, and protect sensitive components from unwanted deposits.
With excellent thermal stability, chemical resistance, and long-term reliability, ThreeBond’s low outgassing formulations meet the strictest industry standards, making them ideal for cleanroom environments and high-precision assemblies.
14 products — filter & search
14 products
| Product | Type | Features | Applications | Appearance | Viscosity | Service temp. |
|---|---|---|---|---|---|---|
1220H 1200 | De-alcohol type RTV silicone | Solvent free, non-sag, quick curing, excellent surface curability and thick film hardening, low-molecular siloxane | Electrical and PCB components sealing | White | 65 Pa.s | -60 to +200°C (250°C) |
1221H 1200 | De-alcohol type RTV silicone | Solvent free, low molecular siloxane content, excellent heat and cold resistance | Securing of PCB components, sealing of connectors, insulating sealing of electric apparatuses and moisture-proof coating of devices | White | - | -60 to +200°C (250°C) |
1530 1500 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable | Multi-purpose adhesive Potting and sealing of electronic parts | White | 100 Pa.s | -40 to +120°C |
1530B 1500 | MS Polymer Moisture curing adhesive | Thixotropic | Multi-purpose adhesive Potting and sealing of electronic parts | Black | 110 Pa.s | -40 to +120°C |
1530C 1500 | MS Polymer Moisture curing adhesive | UL94-HB certified | Multi-purpose adhesive Potting and sealing of electronic parts | Clear | 100 Pa.s | -40 to +120°C |
1533 1500 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable UL94-HB certified DBT free | Multi-purpose adhesive Potting and sealing of electronic parts | White | 100 Pa.s | -40 to +120°C |
1533C 1500 | MS Polymer Moisture curing adhesive | UL94-HB certified DBT free | Multi-purpose adhesive Potting and sealing of electronic parts | Clear | 100 Pa.s | -40 to +120°C |
1537 1500 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts Touch sensor bonding Connector sealing and bonding | White | 55 Pa.s | -40 to +120°C |
1537B 1500 | MS Polymer Moisture curing adhesive | UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts | Black | 55 Pa.s | -40 to +120°C |
1537D 1500 | MS Polymer Moisture curing adhesive | UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts | Grey | 55 Pa.s | -40 to +120°C |
3001C 3000 | Acrylate UV curing resin | High elasticity | PMMA bonding Coating and Potting | Clear | 50 mPa･s | - |
3001C 3000 | Acrylate UV curing resin | High elasticity | PMMA bonding Coating and Potting | Clear | 50 mPa･s | - |
3301F 3300 | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 23 Pa.s | - |
3380B 3300 | Two-component epoxy base resin | Good bonding strength with various metal materials, solvent free, low temperature curing | Bonding of electrical and electronic parts, which requires low outgas, bonding of chip and other parts | Silver | 23 Pa.s | -40 to +100°C |
7721 7700 | Low Blooming Cyanoacrylate Instant Adhesive (Gold Series) | Cyanoacrylate Ethyl, solvent free, moisture curing, low odor and low blooming, fast setting time | Bonding of various materials | Clear yellow | 5 mPa.s | -40 to +100°C |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.