Adhesives in Healthcare devices
Healthcare devices are far more than simple plastic enclosures with a few buttons to protect. They include blood pressure monitors, smartwatches used for health tracking, infusion pumps, patient monitoring systems, portable diagnostic devices, and wearable sensors. These systems combine mechanical components, plastics, electronics, and sometimes direct skin contact all within compact and highly regulated designs.Because they often operate both in close proximity to the patient and as complete electronic systems, they are exposed to demanding conditions. These include temperature variations, repeated sanitization and disinfection cycles, humidity, mechanical shocks, vibrations, and long operating times. In wearable applications, additional constraints such as skin compatibility, sweat exposure, and flexibility must also be considered.
Adhesives and sealants are playing a crucial role in ensuring structural integrity, sealing electronic compartments against moisture and dust, bonding display screens or housings, and securing internal components. They may also contribute to vibration damping, thermal management, and electrical insulation.
Case sealing
Most healthcare devices are composed of a central functional system integrating complex electronics, and an external housing or enclosure designed to protect the internal components. This outer case is not merely aesthetic, it plays a critical role in ensuring mechanical protection, electrical insulation, and environmental sealing.
Bonding the edges of the enclosure is primarily intended to prevent fluids, disinfectants, dust, or other contaminants from penetrating the device and reaching the electronic components inside. In medical environments, exposure to cleaning agents, accidental spills, humidity, and bodily fluids is common. Without proper sealing, such exposure could lead to corrosion, short circuits, or progressive degradation of sensitive parts.

Adhesive bonding along the case perimeter creates a continuous sealing barrier that enhances ingress protection (IP performance). Unlike mechanical fastening alone, adhesive sealing eliminates micro-gaps and ensures uniform distribution of stress along the assembly. This contributes not only to improved waterproofing and chemical resistance, but also to better vibration damping and mechanical stability.
In addition, many healthcare devices are costly, highly regulated, and intended for long-term use. Failure due to fluid ingress can result in device downtime, expensive replacement, or even compromised patient care. For this reason, selecting an appropriate adhesive solution for enclosure bonding is essential to guarantee durability, reliability, and compliance with medical standards.

- Compared to general UV-curing adhesives, the adhesive can be cured at a lower UV dose (10 kJ/m2 )
- Excellent moisture resistance and heat resistance

- Instant adhesive with light-curing property
- Low viscosity and excellent gap penetration
- Blushing can be prevented by irradiation with light
- In areas not exposed to light, it can cure with moisture
Electronical applications
In healthcare devices, we also find classical electronic applications. Various processes are used in electronic applications to protect and bond chips, smart cards, integrated circuits (ICs), processors, and other sensitive components inside healthcare devices. Among the most common techniques are die attach, globe top, edge bonding, and dam & fill.
Chip edge bonding (or edge sealing) consists of dispensing adhesive only along the edges of the mounted component. Rather than fully encapsulating the chip, this method reinforces mechanical stability and improves resistance to vibration, impact, and thermal cycling. It is often used in applications where access to the top surface must remain unobstructed. 
Chip edge bonding (or edge sealing) consists of dispensing adhesive only along the edges of the mounted component. Rather than fully encapsulating the chip, this method reinforces mechanical stability and improves resistance to vibration, impact, and thermal cycling. It is often used in applications where access to the top surface must remain unobstructed. 
In healthcare devices, these bonding and protection processes are critical. They ensure long-term electronic reliability, resistance to sterilization cycles, and stable performance in environments where failure is simply not acceptable.

- Bonding at 80ºC in 60 min
- Solvent-free
- Syringe type
- Heat curing
- Strong adhesion and good flexibility after curing
- Excellent heat resistance
- Glob Top or Fill resin for potting chip modules with Smart Card process, underfill for CSP & BGA