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Adhesives in Healthcare devices

16/04/2026
needle Healthcare devices are far more than simple plastic enclosures with a few buttons to protect. They include blood pressure monitors, smartwatches used for health tracking, infusion pumps, patient monitoring systems, portable diagnostic devices, and wearable sensors. These systems combine mechanical components, plastics, electronics, and sometimes direct skin contact all within compact and highly regulated designs.

Because they often operate both in close proximity to the patient and as complete electronic systems, they are exposed to demanding conditions. These include temperature variations, repeated sanitization and disinfection cycles, humidity, mechanical shocks, vibrations, and long operating times. In wearable applications, additional constraints such as skin compatibility, sweat exposure, and flexibility must also be considered.

Adhesives and sealants are playing a crucial role in ensuring structural integrity, sealing electronic compartments against moisture and dust, bonding display screens or housings, and securing internal components. They may also contribute to vibration damping, thermal management, and electrical insulation.

Case sealing


Most healthcare devices are composed of a central functional system integrating complex electronics, and an external housing or enclosure designed to protect the internal components. This outer case is not merely aesthetic, it plays a critical role in ensuring mechanical protection, electrical insulation, and environmental sealing.


Bonding the edges of the enclosure is primarily intended to prevent fluids, disinfectants, dust, or other contaminants from penetrating the device and reaching the electronic components inside. In medical environments, exposure to cleaning agents, accidental spills, humidity, and bodily fluids is common. Without proper sealing, such exposure could lead to corrosion, short circuits, or progressive degradation of sensitive parts.



Adhesive bonding along the case perimeter creates a continuous sealing barrier that enhances ingress protection (IP performance). Unlike mechanical fastening alone, adhesive sealing eliminates micro-gaps and ensures uniform distribution of stress along the assembly. This contributes not only to improved waterproofing and chemical resistance, but also to better vibration damping and mechanical stability.

In addition, many healthcare devices are costly, highly regulated, and intended for long-term use. Failure due to fluid ingress can result in device downtime, expensive replacement, or even compromised patient care. For this reason, selecting an appropriate adhesive solution for enclosure bonding is essential to guarantee durability, reliability, and compliance with medical standards.


TB1153E
TB3177
Light-curing adhesive with moisture curability
  • Compared to general UV-curing adhesives, the adhesive can be cured at a lower UV dose (10 kJ/m2 )
  • Excellent moisture resistance and heat resistance
Viscosity1200 mPa.s
ColourYellow to transparent yellow green
HardnessD84
TB1771M
TB1771M
  • Instant adhesive with light-curing property
  • Low viscosity and excellent gap penetration
  • Blushing can be prevented by irradiation with light
  • In areas not exposed to light, it can cure with moisture
Viscosity2 mPa・s
ColourYellow to transparent yellow green

Electronical applications


In healthcare devices, we also find classical electronic applications. Various processes are used in electronic applications to protect and bond chips, smart cards, integrated circuits (ICs), processors, and other sensitive components inside healthcare devices. Among the most common techniques are die attach, globe top, edge bonding, and dam & fill.

globe top Chip edge bonding (or edge sealing) consists of dispensing adhesive only along the edges of the mounted component. Rather than fully encapsulating the chip, this method reinforces mechanical stability and improves resistance to vibration, impact, and thermal cycling. It is often used in applications where access to the top surface must remain unobstructed.
Die attach refers to the application of an adhesive beneath the semiconductor die itself, bonding it to a substrate, lead frame, or printed circuit board (PCB). This process ensures strong mechanical fixation and often contributes to thermal management by facilitating heat dissipation away from the component. The adhesive used must provide high reliability, dimensional stability, and compatibility with reflow or curing processes. die attach
globe top Chip edge bonding (or edge sealing) consists of dispensing adhesive only along the edges of the mounted component. Rather than fully encapsulating the chip, this method reinforces mechanical stability and improves resistance to vibration, impact, and thermal cycling. It is often used in applications where access to the top surface must remain unobstructed.
Dam & fill is a two-step encapsulation process. First, a high-viscosity adhesive “dam” is dispensed around the perimeter of the component to create a containment barrier. Then, a lower-viscosity resin is dispensed inside this area to fill and encapsulate the internal space. This technique allows controlled coverage, preventing overflow while ensuring complete protection of wire bonds and sensitive areas. die attach

In healthcare devices, these bonding and protection processes are critical. They ensure long-term electronic reliability, resistance to sterilization cycles, and stable performance in environments where failure is simply not acceptable.
TB3331D
TB3331D
One Component Heat Curing Olefin based Sealant
  • Bonding at 80ºC in 60 min
  • Solvent-free
  • Syringe type
Viscosity25 Pa.s
ColourSilver
HardnessD65
TB2232E
One component epoxy resin
  • Heat curing
  • Strong adhesion and good flexibility after curing
  • Excellent heat resistance
  • Glob Top or Fill resin for potting chip modules with Smart Card process, underfill for CSP & BGA
Viscosity16 Pa.s
ColourBlack
HardnessD75