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3300 SERIES

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3300 SERIES

#Electro-conductive adhesives

The 3300 Series is a range of advanced conductive adhesives, specially formulated for high-performance applications in various industries. Comprising synthetic resins combined with conductive fillers such as silver, nickel, or carbon, these adhesives provide strong and reliable bonding on a wide range of materials, including plastic, rubber, and ceramic. Designed to meet the increasing demands of modern electronic manufacturing, the 3300 Series adhesives are ideal for assemblies requiring precise conductivity and soldering capabilities.

One of the key advantages of the ThreeBond 3300 Series is its versatility in industrial applications. These adhesives are widely used in critical processes such as:

  • Printed Circuit Board (PCB) Production: Offering secure and reliable bonding for printed circuits, they ensure the optimal performance and durability of electronic devices.
  • Bonding Wire Leads to Electrodes: The strong conductive properties of these adhesives make them ideal for connecting wire leads to electrodes, ensuring electrical continuity in intricate electronic systems.
  • Semiconductor and EMI Parts Bonding: With the ability to securely bond semiconductor elements and EMI (Electromagnetic Interference) parts, the 3300 Series provides crucial performance enhancements in high-tech devices.

Additionally, the series includes anisotropically conductive adhesives that are specifically designed to meet the stringent requirements of high-density, multiterminal circuits. These specialized adhesives ensure precise and strong bonding in applications such as LCD assembly, enabling manufacturers to create smaller, denser, and higher-precision electronic components without sacrificing reliability or performance.

The 3300 Series not only offers excellent bonding strength but also ensures superior electrical conductivity, making it an essential tool for industries focused on precision electronics. By providing advanced solutions for high-density circuits and delicate electronic parts, these adhesives contribute significantly to the production of next-generation technology, ensuring durability, performance, and long-term stability.

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Product nameTypeFeaturesApplicationsAppearanceViscosity
3301FEpoxy silver filled
Heat curing resin
Electro-conductiveElectroconductive bonding of electronic componentsSilver23 Pa.s
3301MEpoxy silver filled
Heat curing resin
Electro-conductiveElectroconductive bonding of electronic componentsSilver67 Pa.s
3301WEpoxy silver filled
Heat curing resin
Electro-conductiveElectroconductive bonding of electronic componentsSilver37 Pa.s
3302BUrethane silver filled
Heat curing resin
Electro-conductiveDeveloped for crystal oscillators and other electronic partsSilver15 Pa.s
3303BSilicone silver filled
Heat curing resin
Electro-conductiveFor connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter
Adhesion of points and fixation of chip parts
Light yellow22 Pa.s
3303G NeoSilicone silver filled
Heat curing resin
Electro-conductiveFor connecting electrodes for small quartz crystals, crystal oscillators and surface acoustic wave filter in piezoelectric elements
Fixing point bonding and chip parts
Silver40 Pa.s
3303MSilicone silver filled
Heat curing resin
Electro-conductiveConnection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters
Spot bonding of various other parts and fixing of chip components
Light yellow40 Pa.s
3303NSilicone silver filled
Heat curing resin
Electro-conductiveConnection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters
Spot bonding of various other parts and fixing of chip components
Light yellow41 Pa.s
3303RSilicone silver filled
Heat curing resin
Electro-conductiveFor connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter
Adhesion of points and fixation of chip parts
Light yellow50 Pa.s
3304JSilicone silver filled
Heat curing resin
Electro-conductiveFor connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter, adhesion of points and fixation of chip parts
Crystal device fixing
Silver80 Pa.s
3315ESolvent based synthetic rubber carbon filled
Drying resin
Electro-conductive
Forms a flexible electroconductive film
Electroconductive bonding of paper feed anti-static rollers and core bars of copying machines
Grounding of electronic components
Black600 mPa.s
3331DEpoxy silver filled
Heat curing resin
Electro-conductive
Fast cure at low temperature
Grounding and conductive bonding of electronic components
Die attach
Electromagnetic wave shielding
Silver25 Pa.s
3333FSilicone silver filled
Heat curing resin
Electro-conductive
High stretching properties
Ensuring of continuity of bent, stretched and sliding parts
Grounding
Electromagnetic wave shielding
Brown20 Pa.s
3350BSolvent based acrylic
silver filled
Drying resin
Electro-conductive
Cures at room temperature
Spot bonding
Screw conductive locking
Circuit repair
Electromagnetic wave
Silver2.5 Pa.s
3350CSolvent based acrylic
silver filled
Drying resin
Electro-conductive
Cures at room temperature
Spot bonding
Screw conductive locking
Circuit repair
Electromagnetic wave
Silver1 Pa.s
3351CSolvent based acrylic
nickel filled
Drying resin
Electro-conductive
Cures at room temperature
Halogen free
Developed for various electronic devices and components, securing continuity at coating films and spot-welded joints, grounding of electronic partsGrey3 Pa.s
3373CAnisotropic Conductive Paste
(ACP)
Gold plated particles
Screen printable
Developed for FPCBsLight yellowish green81 Pa.s
3373FAnisotropic Conductive Paste
(ACP)
Gold plated particles
Screen printable
Bonding and connecting of touch panels and FPCs
Bonding and connecting of membrane switches
Bonding and connecting of EL backlight terminals
Greyish white60 Pa.s
3374Anisotropic Conductive Paste
(ACP)
Gold plated particles
Screen printable
Solvent free
Electrical connection
Bonding between electrical
circuits
Flip chip
Greyish brown140 Pa.s
3380Two-Part Epoxy silver filled heat curing resinElectro-conductive
(Silver)
Electroconductive bonding of electronic componentsSilver(1 : 1)
70 : 120 Pa.s
3381Two-Part Epoxy nickel filled heat curing resinElectro-conductive
(Nickel)
Electroconductive bonding of electronic componentsBlack(1 : 1)
100 : 90 Pa.s

Some products are specialised and need to be used by a professional. Please, check the MSDS before use.

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