3300 SERIES
3300 SERIES
#Electro-conductive adhesives

The 3300 Series is a range of advanced conductive adhesives, specially formulated for high-performance applications in various industries. Comprising synthetic resins combined with conductive fillers such as silver, nickel, or carbon, these adhesives provide strong and reliable bonding on a wide range of materials, including plastic, rubber, and ceramic. Designed to meet the increasing demands of modern electronic manufacturing, the 3300 Series adhesives are ideal for assemblies requiring precise conductivity and soldering capabilities.
One of the key advantages of the ThreeBond 3300 Series is its versatility in industrial applications. These adhesives are widely used in critical processes such as:
- Printed Circuit Board (PCB) Production: Offering secure and reliable bonding for printed circuits, they ensure the optimal performance and durability of electronic devices.
- Bonding Wire Leads to Electrodes: The strong conductive properties of these adhesives make them ideal for connecting wire leads to electrodes, ensuring electrical continuity in intricate electronic systems.
- Semiconductor and EMI Parts Bonding: With the ability to securely bond semiconductor elements and EMI (Electromagnetic Interference) parts, the 3300 Series provides crucial performance enhancements in high-tech devices.
Additionally, the series includes anisotropically conductive adhesives that are specifically designed to meet the stringent requirements of high-density, multiterminal circuits. These specialized adhesives ensure precise and strong bonding in applications such as LCD assembly, enabling manufacturers to create smaller, denser, and higher-precision electronic components without sacrificing reliability or performance.
The 3300 Series not only offers excellent bonding strength but also ensures superior electrical conductivity, making it an essential tool for industries focused on precision electronics. By providing advanced solutions for high-density circuits and delicate electronic parts, these adhesives contribute significantly to the production of next-generation technology, ensuring durability, performance, and long-term stability.
Try using keywords to make your search easier !
| Product name | Type | Features | Applications | Appearance | Viscosity |
|---|---|---|---|---|---|
| 3301F | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 23 Pa.s |
| 3301M | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 67 Pa.s |
| 3301W | Epoxy silver filled Heat curing resin | Electro-conductive | Electroconductive bonding of electronic components | Silver | 37 Pa.s |
| 3302B | Urethane silver filled Heat curing resin | Electro-conductive | Developed for crystal oscillators and other electronic parts | Silver | 15 Pa.s |
| 3303B | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts | Light yellow | 22 Pa.s |
| 3303G Neo | Silicone silver filled Heat curing resin | Electro-conductive | For connecting electrodes for small quartz crystals, crystal oscillators and surface acoustic wave filter in piezoelectric elements Fixing point bonding and chip parts | Silver | 40 Pa.s |
| 3303M | Silicone silver filled Heat curing resin | Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components | Light yellow | 40 Pa.s |
| 3303N | Silicone silver filled Heat curing resin | Electro-conductive | Connection of piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters Spot bonding of various other parts and fixing of chip components | Light yellow | 41 Pa.s |
| 3303R | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter Adhesion of points and fixation of chip parts | Light yellow | 50 Pa.s |
| 3304J | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter, adhesion of points and fixation of chip parts Crystal device fixing | Silver | 80 Pa.s |
| 3315E | Solvent based synthetic rubber carbon filled Drying resin | Electro-conductive Forms a flexible electroconductive film | Electroconductive bonding of paper feed anti-static rollers and core bars of copying machines Grounding of electronic components | Black | 600 mPa.s |
| 3331D | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding | Silver | 25 Pa.s |
| 3333F | Silicone silver filled Heat curing resin | Electro-conductive High stretching properties | Ensuring of continuity of bent, stretched and sliding parts Grounding Electromagnetic wave shielding | Brown | 20 Pa.s |
| 3350B | Solvent based acrylic silver filled Drying resin | Electro-conductive Cures at room temperature | Spot bonding Screw conductive locking Circuit repair Electromagnetic wave | Silver | 2.5 Pa.s |
| 3350C | Solvent based acrylic silver filled Drying resin | Electro-conductive Cures at room temperature | Spot bonding Screw conductive locking Circuit repair Electromagnetic wave | Silver | 1 Pa.s |
| 3351C | Solvent based acrylic nickel filled Drying resin | Electro-conductive Cures at room temperature Halogen free | Developed for various electronic devices and components, securing continuity at coating films and spot-welded joints, grounding of electronic parts | Grey | 3 Pa.s |
| 3373C | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable | Developed for FPCBs | Light yellowish green | 81 Pa.s |
| 3373F | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable | Bonding and connecting of touch panels and FPCs Bonding and connecting of membrane switches Bonding and connecting of EL backlight terminals | Greyish white | 60 Pa.s |
| 3374 | Anisotropic Conductive Paste (ACP) | Gold plated particles Screen printable Solvent free | Electrical connection Bonding between electrical circuits Flip chip | Greyish brown | 140 Pa.s |
| 3380 | Two-Part Epoxy silver filled heat curing resin | Electro-conductive (Silver) | Electroconductive bonding of electronic components | Silver | (1 : 1) 70 : 120 Pa.s |
| 3381 | Two-Part Epoxy nickel filled heat curing resin | Electro-conductive (Nickel) | Electroconductive bonding of electronic components | Black | (1 : 1) 100 : 90 Pa.s |