ThreeBond Europe

Inverter, converter,
on-board-charger

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#Inverter, Converter, On-board-charger

Inverter converter schema

In modern electrical and automotive systems, inverters, converters and on-board-chargers play a crucial role in power management and energy efficiency.

  • Inverters convert DC (direct current) to AC (alternating current), essential for electric vehicles (EVs), renewable energy systems, and industrial applications.
  • Converters adjust voltage levels by converting DC to DC or AC to DC, ensuring stable power distribution across electronic components.
  • On-board-chargers converts AC power from an external charging source (such as a wall outlet or charging station) into DC power to charge the vehicle’s battery. 

At ThreeBond, we provide high-performance adhesives, sealants, and coatings designed to enhance thermal management, insulation, and durability in inverter and converter applications. Our advanced materials help improve efficiency, reliability, and longevity in cutting-edge power systems.

Product nameTypeFeaturesApplicationsAppearanceViscosityService temperature
1156CAcryl rubber
Heat curing sealant
Good ATF resistance
Excellent engine and gear oils resistance
Heat resistance
Flexibility
Sealing of parts requiring chemical and heat resistanceBlack380 Pa.s-30 to +150°C
1207BAcryl rubber
Moisture curing sealant
Paintable sealantSealing of various partsBlack200 Pa.s-30 to +150°C
1225RTV Silicone (De-alcohol)
Moisture curing sealant
Solvent free, heat conductiveReactor coil heat dissipation, Electrical and PCB components sealingWhite18 Pa.s-60 to +200(250)°C
1225BRTV Silicone (Alcohol)
Moisture curing sealant
Heat conductive (1,5W/m.K)
Low molecular siloxane content (LMW)
TIM : Thermal Interface Material
Electrical and PCB components sealing
Image sensor module heat dissipation
White18 Pa.s-60 to +200(250)°C
1225CRTV Silicone (Alcohol)
Moisture curing sealant
Heat conductive (2,5W/m.K)
Low molecular siloxane content (LMW)
TIM : Thermal Interface Material
Electrical and PCB components sealing
Cell heat radiation
Grey70 Pa.s-60 to +200(250)°C
1226RTV Silicone (Alcohol)
Moisture curing sealant
Good adhesion onto plasticsElectronic control unit sealing
Light source control unit bonding
Plastic case sealing
Gray97 Pa.s-60 to +200(250)°C
1220G/HRTV Silicone (Alcohol)
Moisture curing sealant
Quick curing
Excellent surface curability
Thick film hardening
Low-molecular siloxane content (LMW)
Sealing electronicsG: Clear
H: White
65 Pa.s-60 to +200(250)°C
1530MS Polymer
Moisture curing adhesive
Solvent free
Low odor
Paintable
Multi-purpose adhesive
Potting and sealing of electronic parts
White100 Pa.s-40 to +120°C
1530SMS Polymer
Moisture curing adhesive
Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintableConnector mounted on substrates, potting and moulding of electronic parts
White300 Pa.s-40 to +120°C
1537EMS Polymer
Moisture curing adhesive
UL94-V0 certified
Thixotropic
Multi-purpose adhesive
Potting and sealing of electronic parts
Grey90 Pa.s-40 to +120°C
2045B/2145BTwo-Part Epoxy resin
Room temperature curing
Heat conductive (2,0 W/m.K)TIM : Thermal Interface Material
Fixing of components mounted on substrates
Pink / Blue(4 : 1)
82 : 124 Pa.s
-40 to +150°C
2202Epoxy resin
Heat curing
Cures at low temperature
(from 60°C)
Potting, fixing and sealing electronic components
Case sealing
Connector sealing, potting
Black13 Pa.s-40 to +120°C
2204Epoxy resin
Heat curing
Cures at low temperature
(from 60°C)
Potting, fixing and sealing electronic componentsBlack28 Pa.s-40 to +120°C
2222PEpoxy resin
Heat curing
Solder resistantFixing and sealing electronic components
Magnet bonding
Black45 Pa.s-40 to +130°C
2235LEpoxy resin
Heat curing
High heat resistance
High Tg
Fixing and sealing electronic components
Magnet bonding
Reactor coil heat dissipation
Securing of tip parts
Bonding of needle and needle hub
Black80 Pa.s-40 to +160°C
2237JEpoxy resin
Heat curing
High heat resistance
High Tg, low CTE
Fixing and sealing electronic components
Magnet bonding
Reactor coil heat dissipation
White115 Pa.s-40 to +160°C
2270CEpoxy resin
Heat curing
Heat conductive (0,9W/m.K)Fixing and sealing electronic components
TIM: Thermal Interface Material
Reactor coil heat dissipation
Grey140 Pa.s-40 to +150°C
2270JEpoxy resin
Heat curing
Heat conductive (4,2W/m.K)Fixing and sealing electronic components
TIM: Thermal Interface Material
White117 Pa.s-40 to +120°C
2272FEpoxy resin
Heat curing
UL94-V0 certifiedFixing and sealing electronic componentsBlack117 Pa.s-40 to +130°C
2274BEpoxy resin
Heat curing
Low viscosity
High capillary flow property
Chip reinforcement
Underfill agent
for BGAs and CSPs
Black4.7 Pa.s-40 to +100°C
3013RAcrylate
UV curing resin
Good deep curing
Good heat and moisture resistance
Excellent chemical and mechanical resistance
Protective coating
Encapsulation of connection contacts and electrical components, diodes, LEDs…
Fixing of connection wires
Selective coating of PCB
Light yellow10 Pa.s-
3075EAcrylate
UV curing resin
High flexibilityClear insulating coating of of electronic partsClear20 Pa.s-
3081JAcrylate
UV curing resin
CIPG; Cured In Place Gasket
Excellent LLC resistance
Low compression set
Excellent shape retention
ECU, inverter, housing sealingLight yellow95 Pa.s-
3161Silicone
UV and Moisture curing resin
Rubber elasticity
High heat and cold resistance
Low molecular siloxane content (LMW)
PottingLight yellow3 Pa.s-60 to 200°C
3164Silicone
UV and Moisture curing resin
Rubber elasticity
High heat and cold resistance
Low molecular siloxane content (LMW)
Sealing and bonding, fixing of electronic components
Connector sealing
White50 Pa.s-60 to 200°C

Some products are specialised and need to be used by a professional. Please, check the MSDS before use.

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