Inverter, converter,
on-board-charger
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#Inverter, Converter, On-board-charger

In modern electrical and automotive systems, inverters, converters and on-board-chargers play a crucial role in power management and energy efficiency.
- Inverters convert DC (direct current) to AC (alternating current), essential for electric vehicles (EVs), renewable energy systems, and industrial applications.
- Converters adjust voltage levels by converting DC to DC or AC to DC, ensuring stable power distribution across electronic components.
- On-board-chargers converts AC power from an external charging source (such as a wall outlet or charging station) into DC power to charge the vehicle’s battery.
At ThreeBond, we provide high-performance adhesives, sealants, and coatings designed to enhance thermal management, insulation, and durability in inverter and converter applications. Our advanced materials help improve efficiency, reliability, and longevity in cutting-edge power systems.

| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1156C | Acryl rubber Heat curing sealant | Good ATF resistance Excellent engine and gear oils resistance Heat resistance Flexibility | Sealing of parts requiring chemical and heat resistance | Black | 380 Pa.s | -30 to +150°C |
| 1207B | Acryl rubber Moisture curing sealant | Paintable sealant | Sealing of various parts | Black | 200 Pa.s | -30 to +150°C |
| 1225 | RTV Silicone (De-alcohol) Moisture curing sealant | Solvent free, heat conductive | Reactor coil heat dissipation, Electrical and PCB components sealing | White | 18 Pa.s | -60 to +200(250)°C |
| 1225B | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (1,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Image sensor module heat dissipation | White | 18 Pa.s | -60 to +200(250)°C |
| 1225C | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (2,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Cell heat radiation | Grey | 70 Pa.s | -60 to +200(250)°C |
| 1226 | RTV Silicone (Alcohol) Moisture curing sealant | Good adhesion onto plastics | Electronic control unit sealing Light source control unit bonding Plastic case sealing | Gray | 97 Pa.s | -60 to +200(250)°C |
| 1220G/H | RTV Silicone (Alcohol) Moisture curing sealant | Quick curing Excellent surface curability Thick film hardening Low-molecular siloxane content (LMW) | Sealing electronics | G: Clear H: White | 65 Pa.s | -60 to +200(250)°C |
| 1530 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable | Multi-purpose adhesive Potting and sealing of electronic parts | White | 100 Pa.s | -40 to +120°C |
| 1530S | MS Polymer Moisture curing adhesive | Solvent free, high strength, moisture curing, excellent weather resistance, low odour, contains no solvents, plasticizers or isocyanates, non-staining characteristics against substrate, over-paintable | Connector mounted on substrates, potting and moulding of electronic parts | White | 300 Pa.s | -40 to +120°C |
| 1537E | MS Polymer Moisture curing adhesive | UL94-V0 certified Thixotropic | Multi-purpose adhesive Potting and sealing of electronic parts | Grey | 90 Pa.s | -40 to +120°C |
| 2045B/2145B | Two-Part Epoxy resin Room temperature curing | Heat conductive (2,0 W/m.K) | TIM : Thermal Interface Material Fixing of components mounted on substrates | Pink / Blue | (4 : 1) 82 : 124 Pa.s | -40 to +150°C |
| 2202 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components Case sealing Connector sealing, potting | Black | 13 Pa.s | -40 to +120°C |
| 2204 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components | Black | 28 Pa.s | -40 to +120°C |
| 2222P | Epoxy resin Heat curing | Solder resistant | Fixing and sealing electronic components Magnet bonding | Black | 45 Pa.s | -40 to +130°C |
| 2235L | Epoxy resin Heat curing | High heat resistance High Tg | Fixing and sealing electronic components Magnet bonding Reactor coil heat dissipation Securing of tip parts Bonding of needle and needle hub | Black | 80 Pa.s | -40 to +160°C |
| 2237J | Epoxy resin Heat curing | High heat resistance High Tg, low CTE | Fixing and sealing electronic components Magnet bonding Reactor coil heat dissipation | White | 115 Pa.s | -40 to +160°C |
| 2270C | Epoxy resin Heat curing | Heat conductive (0,9W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material Reactor coil heat dissipation | Grey | 140 Pa.s | -40 to +150°C |
| 2270J | Epoxy resin Heat curing | Heat conductive (4,2W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material | White | 117 Pa.s | -40 to +120°C |
| 2272F | Epoxy resin Heat curing | UL94-V0 certified | Fixing and sealing electronic components | Black | 117 Pa.s | -40 to +130°C |
| 2274B | Epoxy resin Heat curing | Low viscosity High capillary flow property | Chip reinforcement Underfill agent for BGAs and CSPs | Black | 4.7 Pa.s | -40 to +100°C |
| 3013R | Acrylate UV curing resin | Good deep curing Good heat and moisture resistance Excellent chemical and mechanical resistance | Protective coating Encapsulation of connection contacts and electrical components, diodes, LEDs… Fixing of connection wires Selective coating of PCB | Light yellow | 10 Pa.s | - |
| 3075E | Acrylate UV curing resin | High flexibility | Clear insulating coating of of electronic parts | Clear | 20 Pa.s | - |
| 3081J | Acrylate UV curing resin | CIPG; Cured In Place Gasket Excellent LLC resistance Low compression set Excellent shape retention | ECU, inverter, housing sealing | Light yellow | 95 Pa.s | - |
| 3161 | Silicone UV and Moisture curing resin | Rubber elasticity High heat and cold resistance Low molecular siloxane content (LMW) | Potting | Light yellow | 3 Pa.s | -60 to 200°C |
| 3164 | Silicone UV and Moisture curing resin | Rubber elasticity High heat and cold resistance Low molecular siloxane content (LMW) | Sealing and bonding, fixing of electronic components Connector sealing | White | 50 Pa.s | -60 to 200°C |