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Heat dissipation

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#Heat dissipation

ThreeBond’s high thermal conductivity sealants and adhesives are engineered to efficiently transfer heat and protect electronic components from thermal stress. These advanced materials offer excellent adhesion, gap filling, and long-lasting durability, ensuring stable performance even under demanding operating conditions. By providing superior heat dissipation, they help extend the lifespan of electronic devices and improve reliability across a wide range of industrial applications.

Product nameTypeFeaturesApplicationsAppearanceViscosityService temperature
1225BDe-alcohol type RTV siliconeSolvent free, heat conductive, 1.59Wm.kElectrical and PCB components sealingWhite18 Pa.s-60 to +200(250)°C
2270JOne Component Epoxy ResinSolvent free epoxy, heat curing, excellent mechanical, thermal and chemical resistance, heat conductive, 4.2 W/m•kPotting, fixing and sealing electric and electronic componentsWhite150 Pa.s-40 to +180°C
2955 seriesMoisture-curing heat dissipation resinExcellent electrical insulating properties, excellent hear conductivity
Heat dissipation and insulation of switching power supplies, of power ICs, of computer CPUs, heat dissipation and insulation of illumination inverters, of heater devices, of various electronic componentsGrey65 to 130 Pa.s-60 to +200(250)°C

Some products are specialised and need to be used by a professional. Please, check the MSDS before use.

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