Heat dissipation
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#Heat dissipation
ThreeBond’s high thermal conductivity sealants and adhesives are engineered to efficiently transfer heat and protect electronic components from thermal stress. These advanced materials offer excellent adhesion, gap filling, and long-lasting durability, ensuring stable performance even under demanding operating conditions. By providing superior heat dissipation, they help extend the lifespan of electronic devices and improve reliability across a wide range of industrial applications.
| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1225B | De-alcohol type RTV silicone | Solvent free, heat conductive, 1.59Wm.k | Electrical and PCB components sealing | White | 18 Pa.s | -60 to +200(250)°C |
| 2270J | One Component Epoxy Resin | Solvent free epoxy, heat curing, excellent mechanical, thermal and chemical resistance, heat conductive, 4.2 W/m•k | Potting, fixing and sealing electric and electronic components | White | 150 Pa.s | -40 to +180°C |
| 2955 series | Moisture-curing heat dissipation resin | Excellent electrical insulating properties, excellent hear conductivity | Heat dissipation and insulation of switching power supplies, of power ICs, of computer CPUs, heat dissipation and insulation of illumination inverters, of heater devices, of various electronic components | Grey | 65 to 130 Pa.s | -60 to +200(250)°C |