5G Base station
ELECTRONICS MARKET
#5G Base station
A 5G base station is a critical component of modern wireless communication networks, enabling ultra-fast data transmission, low latency, and high connectivity. These stations serve as the backbone of 5G infrastructure, transmitting and receiving signals between user devices and the core network. To ensure reliable performance, base stations must operate in various environmental conditions while managing high-frequency signals and heat dissipation effectively.
ThreeBond provides advanced adhesive and sealing solutions to enhance the durability and efficiency of 5G base stations. Our high-performance materials are used for thermal management, ensuring efficient heat dissipation from high-power components. Structural bonding solutions provide strong adhesion for securing electronic and mechanical parts, while our sealing technologies protect sensitive components from moisture, dust, and extreme temperatures. Additionally, ThreeBond’s advanced potting and coating materials offer enhanced insulation and protection against environmental stress.

| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1225 | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing | White | 18 Pa.s | -60 to +200(250)°C |
| 1537 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts Touch sensor bonding Connector sealing and bonding | White | 55 Pa.s | -40 to +120°C |
| 2270 | Epoxy resin Heat curing | Solvent free epoxy, heat curing, excellent mechanical, thermal and chemical resistance, heat conductive | Fixing and sealing electronic components TIM: Thermal Interface Material | Grey | 140 Pa.s | -40 to +150°C |
| 2400 series | Pre-coated screws locking agents | Various type of strengths | Screw fixing | Various colours | Various densities | - |
| 2955 | Modified silane resin Moisture curing TIM (Thermal Interface Material) | Heat conductive (4.8 W/m.K) | Heat dissipation | Grey | 120 Pa.s | - |
| 3166 | Silicone UV curing resin | CIPG : Cured In Place Gasket Ultra soft rubber Excellent heat and moisture resistance High shape retention | Case sealing of electrical and electronic parts Case and lens mount waterproofness and dustproofness | Blue | 330 Pa.s | - |
| 3178 | Polyolefin UV curing resin | LED curing compatible Low moisture permeability Low gas permeability High chemical resistance | Fuel cells sealing | White | 155 Pa.s | - |
| 3331D | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding | Silver | 25 Pa.s | - |
| 3333F | Silicone silver filled Heat curing resin | Electro-conductive High stretching properties | Ensuring of continuity of bent, stretched and sliding parts Grounding Electromagnetic wave shielding | Brown | 20 Pa.s | - |