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5G Base station

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#5G Base station

A 5G base station is a critical component of modern wireless communication networks, enabling ultra-fast data transmission, low latency, and high connectivity. These stations serve as the backbone of 5G infrastructure, transmitting and receiving signals between user devices and the core network. To ensure reliable performance, base stations must operate in various environmental conditions while managing high-frequency signals and heat dissipation effectively.

ThreeBond provides advanced adhesive and sealing solutions to enhance the durability and efficiency of 5G base stations. Our high-performance materials are used for thermal management, ensuring efficient heat dissipation from high-power components. Structural bonding solutions provide strong adhesion for securing electronic and mechanical parts, while our sealing technologies protect sensitive components from moisture, dust, and extreme temperatures. Additionally, ThreeBond’s advanced potting and coating materials offer enhanced insulation and protection against environmental stress.

Product nameTypeFeaturesApplicationsAppearanceViscosityService temperature
1225RTV Silicone (Alcohol)
Moisture curing sealant
Heat conductive
Low molecular siloxane content (LMW)
TIM : Thermal Interface Material
Electrical and PCB components sealing
White18 Pa.s-60 to +200(250)°C
1537MS Polymer
Moisture curing adhesive
Solvent free
Low odor
Paintable
UL94-V0 certified
Multi-purpose adhesive
Potting and sealing of electronic parts
Touch sensor bonding
Connector sealing and bonding
White55 Pa.s-40 to +120°C
2270Epoxy resin
Heat curing
Solvent free epoxy, heat curing, excellent mechanical, thermal and chemical resistance, heat conductiveFixing and sealing electronic components
TIM: Thermal Interface Material
Grey140 Pa.s-40 to +150°C
2400 seriesPre-coated screws locking agentsVarious type of strengthsScrew fixingVarious coloursVarious densities-
2955Modified silane resin
Moisture curing TIM
(Thermal Interface Material)
Heat conductive (4.8 W/m.K)Heat dissipationGrey120 Pa.s-
3166Silicone
UV curing resin
CIPG : Cured In Place Gasket
Ultra soft rubber
Excellent heat and moisture resistance
High shape retention
Case sealing of electrical and electronic parts
Case and lens mount waterproofness and dustproofness
Blue330 Pa.s-
3178Polyolefin
UV curing resin
LED curing compatible
Low moisture permeability
Low gas permeability
High chemical resistance
Fuel cells sealingWhite155 Pa.s-
3331DEpoxy silver filled
Heat curing resin
Electro-conductive
Fast cure at low temperature
Grounding and conductive bonding of electronic components
Die attach
Electromagnetic wave shielding
Silver25 Pa.s-
3333FSilicone silver filled
Heat curing resin
Electro-conductive
High stretching properties
Ensuring of continuity of bent, stretched and sliding parts
Grounding
Electromagnetic wave shielding
Brown20 Pa.s-
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.

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