SMARTPHONE AND TABLETS
ELECTRONICS MARKET
#Smartphone and tablets
At ThreeBond, we offer a wide range of specialized adhesives and sealants tailored for smartphone and tablets, including optically clear materials and electro-conductive adhesives. Designed to meet the precise specifications of mobile device manufacturers, our solutions help produce thinner, lighter, and more advanced devices.
From touch screen and Organic EL panel bonding to electronic component assembly and BGA/CSP reinforcement, our adhesives support key applications to enhance the performance and functionality of modern smartphones and tablets.
| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1225B | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (1,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Image sensor module heat dissipation | White | 18 Pa.s | -60 to +200(250)°C |
| 1225C | RTV Silicone (Alcohol) Moisture curing sealant | Heat conductive (2,5W/m.K) Low molecular siloxane content (LMW) | TIM : Thermal Interface Material Electrical and PCB components sealing Cell heat radiation | Grey | 70 Pa.s | -60 to +200(250)°C |
| 1357K | Acrylate resin Anaerobic adhesive | High strength Heat resistant Low halogen | Bonding of metallic part fitting areas Laminated core bonding Bearing fixing Vibrating motor Magnet bonding | Blue | 12 Pa.s | -40 to +175°C |
| 1539 | Castor oil polymer Moisture and heat curing adhesive | Environment-friendly (plant-derived polymer) Excellent vibration and impact resistance Low temperature curing (60°C) | Bonding, sealing and potting of various materials Touch sensor bonding Connector sealing and bonding Gap filling between camera and case Cover panel adhesion | Black | 100 Pa.s | -35 to +100°C |
| 2206S | Epoxy resin Heat curing | Cures at low temperature Low halogen | Potting, fixing and sealing electronic components | Black | 15 Pa.s | -40 to +120°C |
| 2270J | Epoxy resin Heat curing | Heat conductive (4,2W/m.K) | Fixing and sealing electronic components TIM: Thermal Interface Material | White | 117 Pa.s | -40 to +120°C |
| 3020B | Acrylate UV curing resin | LED curing compatible Colored black after curing | Coating of exteriors of electrical and electronic components Coating and bonding of parts requiring masking effect Glass and resin lenses bonding LC panel end face coating Cover panel end face coating | Light yellow | 3.5 Pa.s | - |
| 3027G | Acrylate UV curing resin | LED curing compatible Low water absorption rate Good moisture resistance | For ITO molding | Light yellow | 2 Pa.s | - |
| 3027J | One-component solvent free acrylic resin | UV-LED curing, low halogen content, low water rate absorption rate and good moisture resistance | Cover panel end face coating | Black | 2.4 Pa.s | - |
| 3081J | Acrylate UV curing resin | LED curing compatible Low halogen content | Cover panel end face coating | Black | 2.4 Pa.s | - |
| 3166 | Silicone UV curing resin | CIPG : Cured In Place Gasket Ultra soft rubber Excellent heat and moisture resistance High shape retention | Case sealing of electrical and electronic parts Case and lens mount waterproofness and dustproofness | Blue | 330 Pa.s | - |
| 3170B | Acrylate Visible light curing resin | Thick film curability | For optical parts Bonding, fixing IR cut-off filter | Light yellow | 1.8 Pa.s | - |
| 3304J | Silicone silver filled Heat curing resin | Electro-conductive | For connection of the piezoelectric element with the electrode of crystal unit, crystal oscillator, and surface wave elasticity filter, adhesion of points and fixation of chip parts Crystal device fixing | Silver | 80 Pa.s | - |
| 3331D | Epoxy silver filled Heat curing resin | Electro-conductive Fast cure at low temperature | Grounding and conductive bonding of electronic components Die attach Electromagnetic wave shielding | Silver | 25 Pa.s | - |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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INDUSTRIAL ADHESIVES
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ONE-COMPONENT EPOXY RESINS
