#Camera module
Threebond's advanced adhesives and sealants play a crucial role in enhancing the performance and durability of camera modules. Our solutions are ideal for case sealing, chip reinforcement, connector sealing, and lens fixing, providing strong, reliable bonds in even the most demanding environments. Whether you're securing camera components, protecting sensitive chips from moisture or dust, or ensuring precise lens alignment, Threebond adhesives offer superior adhesion, resistance, and longevity. Trust our products to deliver the performance and protection your camera modules need for optimal functionality.9 products — filter & search
9 products
| Product | Type | Features | Applications | Appearance | Viscosity | Service temp. |
|---|---|---|---|---|---|---|
1537 1500 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts Touch sensor bonding Connector sealing and bonding | White | 55 Pa.s | -40 to +120°C |
1539 1500 | Castor oil polymer Moisture and heat curing adhesive | Environment-friendly (plant-derived polymer) Excellent vibration and impact resistance Low temperature curing (60°C) | Bonding, sealing and potting of various materials Touch sensor bonding Connector sealing and bonding Gap filling between camera and case Cover panel adhesion | Black | 100 Pa.s | -35 to +100°C |
2202 2200 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components Case sealing Connector sealing, potting | Black | 13 Pa.s | -40 to +120°C |
2274S 2200 | Epoxy resin Heat curing | Low viscosity High capillary flow property | Chip reinforcement Underfill agent for BGAs and CSPs | Blue | 3.8 Pa.s | -40 to +130°C |
2296B 2200 | Epoxy resin Heat curing | Fast cure at low temperature (from 60°C) Thixotropic Excellent shape retention | Camera module components bonding FPC reinforcement Flat spring and magnet fixing Fixing diffusing lens | Black | 18.5 Pa.s | -40 to +100°C |
3081J 3000 | Acrylate UV curing resin | CIPG — Cured In Place Gasket Excellent LLC resistance Low compression set Excellent shape retention | ECU, inverter, housing sealing | Light yellow | 95 Pa.s | — |
3114 3100 | Epoxy UV curing resin | Low shrinkage Low CTE | Bonding and securing of optical parts Suitable for precisely bonding electronic parts Lens fixing Image sensor fixing | Grey white | 26 Pa.s | — |
3164D 3100 | Silicone UV and moisture curing resin | Rubber elasticity High heat and cold resistance Low molecular siloxane content (LMW) | Sealing and bonding of electronic components Connector sealing | White | 10 Pa.s | -60 to +200°C |
3170B 3100 | Acrylate Visible light curing resin | Thick film curability | Bonding optical parts Bonding and fixing IR cut-off filter | Light yellow | 1.8 Pa.s | — |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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