Camera module
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#Camera module
Threebond’s advanced adhesives and sealants play a crucial role in enhancing the performance and durability of camera modules. Our solutions are ideal for case sealing, chip reinforcement, connector sealing, and lens fixing, providing strong, reliable bonds in even the most demanding environments. Whether you’re securing camera components, protecting sensitive chips from moisture or dust, or ensuring precise lens alignment, Threebond adhesives offer superior adhesion, resistance, and longevity. Trust our products to deliver the performance and protection your camera modules need for optimal functionality.
| Product name | Type | Features | Applications | Appearance | Viscosity | Service temperature |
|---|---|---|---|---|---|---|
| 1537 | MS Polymer Moisture curing adhesive | Solvent free Low odor Paintable UL94-V0 certified | Multi-purpose adhesive Potting and sealing of electronic parts Touch sensor bonding Connector sealing and bonding | White | 55 Pa.s | -40 to +120°C |
| 1539 | Castor oil polymer Moisture and heat curing adhesive | Environment-friendly (plant-derived polymer) Excellent vibration and impact resistance Low temperature curing (60°C) | Bonding, sealing and potting of various materials Touch sensor bonding Connector sealing and bonding Gap filling between camera and case Cover panel adhesion | Black | 100 Pa.s | -35 to +100°C |
| 2202 | Epoxy resin Heat curing | Cures at low temperature (from 60°C) | Potting, fixing and sealing electronic components Case sealing Connector sealing, potting | Black | 13 Pa.s | -40 to +120°C |
| 2274S | Epoxy resin Heat curing | Low viscosity High capillary flow property | Chip reinforcement Underfill agent for BGAs and CSPs | Blue | 3.8 Pa.s | -40 to +130°C |
| 2296B | Epoxy resin Heat curing | Fast cure at low temperature (from 60°C) Thixotropic Excellent shape retention | Camera module components bonding FPC reinforcement Flat spring and magnet fixing Fixing diffusing lens | Black | 18.5 Pa.s | -40 to +100°C |
| 3081J | Acrylate UV curing resin | CIPG; Cured In Place Gasket Excellent LLC resistance Low compression set Excellent shape retention | ECU, inverter, housing sealing | Light yellow | 95 Pa.s | - |
| 3114 | Epoxy UV curing resin | Low shrinkage Low CTE | Bonding and securing of optical parts Suitable for precisely bonding and securing electronic parts Lens fixing Image sensor fixing | Grey white | 26 Pa.s | - |
| 3164D | Silicone UV and Moisture curing resin | Rubber elasticity High heat and cold resistance Low molecular siloxane content (LMW) | Sealing and bonding, fixing of electronic components Connector sealing | White | 10 Pa.s | -60 to 200°C |
| 3170B | Acrylate Visible light curing resin | Thick film curability | For optical parts Bonding, fixing IR cut-off filter | Light yellow | 1.8 Pa.s | - |
Some products are specialised and need to be used by a professional. Please, check the MSDS before use.
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